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Gate Bias and Length Dependences of Total-Ionizing-Dose Effects in InGaAs FinFETs on Bulk Si
摘要： We evaluate the total-ionizing-dose (TID) responses of InGaAs nMOS FinFETs with different gate lengths irradiated with 10-keV X-rays under different gate biases. The largest degradation after irradiation occurs at VG = -1 V. Radiation-induced trapped positive charge dominates the TID response of InGaAs FinFET transistors, consistent with previous results for InGaAs multi-fin capacitors. Shorter gate-length devices show larger radiation-induced charge trapping than longer gate-length devices, most likely due to the electrostatic effects of trapped charge in the surrounding SiO2 isolation and SiO2/Si3N4 spacer oxides. 1/f noise measurements indicate a high trap density and a non-uniform defect-energy distribution, consistent with a strong variation of effective border-trap density with surface potential.
关键词： 1/f noise,FinFETs,InGaAs,Total-Ionizing-Dose,Bulk Si,border-trap,Gate length dependence,III-V
更新于2025-09-19 17:15:36
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Border trap evaluation for SiO <sub/>2</sub> /GeO <sub/>2</sub> /Ge gate stacks using deep-level transient spectroscopy
摘要： A border trap (BT) evaluation method was established for SiO2/GeO2/Ge gate stacks by using deep-level transient spectroscopy with a lock-in integrator. Ge metal-oxide-semiconductor capacitors (MOSCAPs) with SiO2/GeO2/Ge gate stacks were fabricated by using different methods. The interface trap (IT) and BT signals were successfully separated based on their different dependences on the intensity of injection pulses. By using p-type MOSCAPs, BTs at the position of 0.4 nm from the GeO2/Ge interface were measured. The energy of these BTs was centralized at the position near to the valence band edge of Ge, and their density (Nbt) was in the range of 1017–1018 cm?3. By using n-type MOSCAPs, BTs at the position range of 2.8–3.4 nm from the GeO2/Ge interface were measured, of which Nbt varied little in the depth direction. The energy of these BTs was distributed in a relatively wide range near to the conduction band edge of Ge, and their Nbt was approximately one order of magnitude higher than those measured by p-MOSCAPs. This high Nbt value might originate from the states of the valence alternation pair with energy close to 1 eV above the conduction band edge of Ge. We also found that Al post metallization annealing can passivate both ITs and BTs near to the valence band edge of Ge but not those near to the conduction band edge.
关键词： deep-level transient spectroscopy,valence band edge,conduction band edge,interface trap,border trap,Ge metal-oxide-semiconductor capacitors
更新于2025-09-09 09:28:46