- 标题
- 摘要
- 关键词
- 实验方案
- 产品
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[IEEE 2018 International Conference on Optical MEMS and Nanophotonics (OMN) - Lausanne (2018.7.29-2018.8.2)] 2018 International Conference on Optical MEMS and Nanophotonics (OMN) - Digital Silicon Photonic MEMS Phase-Shifter
摘要： We report on a 4-bit digital silicon photonic MEMS phase-shifter with sub-microsecond switching time and low power consumption (< 10 uW). The device consists of 4 digitally switched phase-shifting units, which in total enable phase shift from (cid:2)(cid:2)(cid:1)/8 to 15pi/8 in increments of (cid:2)(cid:1)/8.
关键词： Silicon Photonic MEMS,Adiabatic Coupler,Phase Control,Photonic Integrated Circuit,Optical Switch
更新于2025-09-23 15:21:01
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A Balanced-to-Single-Ended Wilkinson Power Divider
摘要： A balanced-to-single-ended (BTSE) Wilkinson power divider of planar microstrip structure is proposed in this paper. It has a balanced input and two single-ended outputs. Cascade of a balun and a conventional power divider can be replaced by this proposed structure. Based on the theory of mixed-mode S parameters and the admittance matrix method, the critical parameters are determined. The four-port network is analyzed by simplifying it to two-port network with other ports matched at the central frequency. Then the key parameters are derived and the impact of a freely selected variable on the bandwidth is also discussed. An example of 2.4GHz BTSE power divider is designed. The simulated and measured results show the effectiveness of the method: differential-mode transmissions are better than -3.25dB, common-mode transmissions are lower than -28.6dB, common- mode return loss is -0.10dB, differential-mode return loss and isolation is lower than -23.7dB. While the operating bandwidth is 20%.
关键词： mixed-mode S-matrix,balanced circuit,power divider
更新于2025-09-23 15:21:01
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Overall Noise Analysis for Transisition Edge Sensor at Optical and Infra-Red Wavelengths
摘要： Transition-Edge Sensors (TESs) are the most promising devices as single photon detectors in the visible and infrared range. In particular ultra-fast TESs with few hundred ns response time and high quantum efficiency find application in different fields like quantum optics, quantum metrology and quantum information. In this work, the main objective is to measure the noise effect on the performance of the TESs when operated at visible and infrared wavelengths as the TESs performance depends on the sensor parameters and also on the noise level. The noise analysis is done by experimentally calculating the noise generated by the different block of the Single quantum interface device and to the TES. We have also . The above estimate is valid for seen from our numerical analysis that the overall noise of the system is the low-temperature steady –state biasing conditions of our TES device.
关键词： Photo Detectors,Single Quantum Interference Device,Gain of Op-Amp,Tank Circuit
更新于2025-09-23 15:21:01
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Failure analysis of 650?V enhancement mode GaN HEMT after short circuit tests
摘要： The paper presents the results of a post failure analysis performed on commercial 650 V GaN power HEMT after short circuit destructive tests. The used experiment set up includes a protection circuit able to avoid the explosion of the sample during the test. Moreover, it limits the energy involved in the failure and facilitates the identification of the areas where the failure is initiated. The post failure analysis confirms that DUTs exhibit two kinds of failures. In the first failure mode, for which large energies are dissipated in the device before the failure, the damaged area of the chip is quite large and is located close to external drain contacts. In this area, very likely, the temperature exceeds the melting temperature of the metallization. The second failure mode is observed for higher values of the drain voltage and involves lower energies dissipated in the DUT during SC before the failure. In this case, the damaged area is very small and is located below the source field plate at gate edge on the drain side. 2D finite element simulations show that in this region the dissipated power density becomes very high and can cause the local temperature to exceed the temperature limit of GaN/AlGaN structure.
关键词： GaN power HEMT,Short circuit,Failure analysis
更新于2025-09-23 15:21:01
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[IEEE 2019 Compound Semiconductor Week (CSW) - Nara, Japan (2019.5.19-2019.5.23)] 2019 Compound Semiconductor Week (CSW) - Room-Temperature Electrically Pumped InP-based $1.3\boldsymbol{\mu} \mathbf{m}$ Quantum Dot Laser on on-axis (001) Silicon
摘要： We present a method for quantifying a risk for killer defects at layer level and estimating yield for substrate packages using information from design ?les. To calculate risk ranks and predicted yield, we de?ne a risk distance that is a key parameter extracted from designs using image processing techniques. In order to validate our model, we analyze two different designs, each having multiple layers, and compare with data from baseline lots. It is shown that there is an inverse correlation between risk layer ranks and yield. Estimated yield based on our model is compared with baseline yield for four layers of the second design. The model-to-baseline yield difference is less than 1% for three layers we tested.
关键词： yield estimation,assembly,circuit analysis,metrology sampling,Yield prediction,integrated circuit packaging
更新于2025-09-23 15:19:57
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[IEEE 2019 Compound Semiconductor Week (CSW) - Nara, Japan (2019.5.19-2019.5.23)] 2019 Compound Semiconductor Week (CSW) - Effect of Annealing on The Bottom Cell in GaInP/GaAs/GaInNAsSb Triple Junction Solar Cells by MBE/MOCVD Hybrid Growth
摘要： We present a method for quantifying a risk for killer defects at layer level and estimating yield for substrate packages using information from design ?les. To calculate risk ranks and predicted yield, we de?ne a risk distance that is a key parameter extracted from designs using image processing techniques. In order to validate our model, we analyze two different designs, each having multiple layers, and compare with data from baseline lots. It is shown that there is an inverse correlation between risk layer ranks and yield. Estimated yield based on our model is compared with baseline yield for four layers of the second design. The model-to-baseline yield difference is less than 1% for three layers we tested.
关键词： yield estimation,assembly,circuit analysis,metrology sampling,Yield prediction,integrated circuit packaging
更新于2025-09-23 15:19:57
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5-Channel Polymer/Silica Hybrid Arrayed Waveguide Grating
摘要： A 5-channel polymer/silica hybrid arrayed waveguide grating (AWG), fabricated through a simple and low-cost microfabrication process is proposed, which covers the entire O-band (1260–1360 nm) of the optical communication wavelength system. According to the simulation results, the insertion loss is lower than 4.7 dB and the crosstalk within 3-dB bandwidth is lower than ~?28 dB. The actual fiber–fiber insertion loss is lower than 14.0 dB, and the crosstalk of the 5 channels is less than ?13.0 dB. The demonstrated AWG is ideally suitable for optical communications, but also has potential in the multi-channel sensors.
关键词： integrated optics,polymer optical waveguides,planar lightwave circuit,optical communication systems
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Industrial Production and Field Evaluation of Transparent Electrodynamic Screen (EDS) Film for Water-Free Cleaning of Solar Collectors
摘要： Since their introduction, field programmable gate arrays (FPGAs) have grown in capacity by more than a factor of 10 000 and in performance by a factor of 100. Cost and energy per operation have both decreased by more than a factor of 1000. These advances have been fueled by process technology scaling, but the FPGA story is much more complex than simple technology scaling. Quantitative effects of Moore’s Law have driven qualitative changes in FPGA architecture, applications and tools. As a consequence, FPGAs have passed through several distinct phases of development. These phases, termed ‘‘Ages’’ in this paper, are The Age of Invention, The Age of Expansion and The Age of Accumulation. This paper summarizes each and discusses their driving pressures and fundamental characteristics. The paper concludes with a vision of the upcoming Age of FPGAs.
关键词： commercialization,programmable logic,Moore’s Law,Application-specific integrated circuit (ASIC),economies of scale,field-programmable gate array (FPGA),industrial economics
更新于2025-09-23 15:19:57
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Examination of relationship between Urbach energy and open-circuit voltage deficit of flexible Cu(In,Ga)Se <sub/>2</sub> solar cell for its improved photovoltaic performance
摘要： Flexible Cu(In,Ga)Se2 (CIGSe) solar cells on stainless steel (SUS) substrates are developed. The contribution concentrates on the investigation of the correlation between Urbach energy (EU) and open-circuit voltage deficit (VOC,def). The several CIGSe solar cells on soda-lime glass and SUS substrates with various VOC,def values are fabricated through the variations of [Ga]/([Ga]+[In]) ratio (GGI), substrate temperature (TSUB) and Fe concentration of their CIGSe absorbers. The EU is determined based on external quantum efficiency in the long-wavelength edge. It is determined that the EU is influenced by the GGI, TSUB and Fe concentration. The EU is well consistent with the carrier lifetimes and can be an indicator of the CIGSe quality. In addition, the relationship between EU and VOC,def is obviously observed, where the decrease in the EU by 1 meV reduces the VOC,def by 8.6 mV. Through the optimizations of GGI and TSUB as well as the minimization of Fe concentration, the EU is obviously reduced, which implies the improvement of the CIGSe quality. Ultimately, the high η of 17.9% for the flexible CIGSe solar cell on SUS substrate is attained.
关键词： Cu(In,Ga)Se2,stainless steel substrate,TRPL carrier lifetime,Urbach energy,open-circuit voltage deficit
更新于2025-09-23 15:19:57
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Folded aperture coupled patch antenna fabricated on FPC with vertically polarised end-fire radiation for fifth-generation millimetre-wave massive MIMO systems
摘要： The authors proposed a folded aperture-coupled patch antenna (ACPA) on a flexible printed circuit (FPC) with vertically polarised end-fire radiation, suitable for fifth-generation millimetre-wave massive multi-input–multi-output (MIMO) systems. For low-cost implementation, antenna elements were fabricated on a single polyimide substrate. The fabricated FPC was first folded to implement a three-layer ACPA, and then the feed line was bent 90° to achieve end-fire radiation. Measurement of five antenna samples demonstrates that the resonance frequency lies between 27.7 and 28.3?GHz. Each antenna sample has the bandwidth (|S11|?<??10?dB) >1.2?GHz. The measured antenna gain is 2.74?dBi at 28.1?GHz, and the difference between co- and cross-polarised radiation intensities is >15?dB in all directions of interest. To improve the impedance bandwidth and the gain further, they increased the distance between the patch and the aperture of the proposed antenna by folding the fabricated FPC multiple times without an additional layer. Experimental results confirm the bandwidth of 2.64?GHz (26.27–28.91?GHz) and the gain of 3.80?dBi at 28?GHz. Additionally, the 1?×?8-folded APCA array is simulated to verify the feasibility for a practical application of multi-beam massive MIMO technology.
关键词： flexible printed circuit,fifth-generation millimetre-wave,massive MIMO systems,folded aperture-coupled patch antenna,vertically polarised end-fire radiation
更新于2025-09-23 15:19:57