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Enhanced operational stability through interfacial modification by active encapsulation of perovskite solar cells
摘要： Encapsulates are, in general, the passive components of any photovoltaic device that provides the required shielding from the externally stimulated degradation. Here we provide comprehensive physical insight depicting a rather non-trivial active nature, in contrast to the supposedly passive, atomic layer deposition (ALD) grown Al2O3 encapsulate layer on the hybrid perovskite [(FA0.83MA0.17)0.95Cs0.05PbI2.5Br0.5] photovoltaic device having the configuration: glass/FTO/SnO2/perovskite/spiro-OMeTAD/Au/(6) Al2O3. By combining various electrical characterization techniques, our experimental observations indicate that the ALD chemistry produces considerable enhancement of the electronic conductivity of the spiro-OMeTAD hole transport medium (HTM), resulting in electronic modification of the perovskite/HTM interface. Subsequently, the modified interface provides better hole extraction and lesser ionic accumulation at the interface, resulting in a significant lowering of the burn-in decay and nearly unchanged charge transport parameters explicitly under the course of continuous operation. Unlike the unencapsulated device, the modified electronic structure in the Al2O3 coated device is essentially the principal reason for better performance stability. Data presented in this communication suggest that the ionic accumulation at the spiro-OMeTAD/perovskite interface triggers the device degradation in the uncoated devices, which is eventually followed by material degradation, which can be avoided by active encapsulation.
关键词： encapsulation,Al2O3,atomic layer deposition,operational stability,perovskite solar cells
更新于2025-09-23 15:19:57
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Ethanol-Precipitable Silica-Passivated Perovskite Nanocrystals Incorporated into Polystyrene Microspheres for Long-Term Storage and Re-Usage
摘要： Perovskite nanocrystals (PNCs) are emerging luminescent materials due to their fascinating physic-optical properties. However, their sensitive surface chemistry with organic polar solvents, oxygen and moisture greatly hinders their developments towards practical applications. Herein we promote silica-passivated PNCs (SP-PNCs) by in situ hydrolyzing the surface ligands of (3-aminopropyl) triethoxysilane. The resultant SP-PNCs possesses a high quantum yield (QY) of 80% and are precipitable by polar solvents, such as ethanol and acetone, without destroying their surface chemistry or losing QY, which offers an eco-friendly and efficient method for separation, purification and phase transfer of PNCs compared with the traditional solvent evaporation technique. Moreover, we further promoted a swelling-deswelling encapsulation process to incorporate the as-made SP-PNCs into polystyrene microspheres (PMs), which can largely increase the stability of the SP-PNCs against moisture for long-term storage. Besides, the embedded SP-PNCs can also be reused and mono-dispersed by totally dissolving the PMs in suitable solvents for making all-solution-processed devices. We thereby believe this work should open new avenues for greener synthesis, scalable production, and long-term storage of PNCs towards the emerging practical applications.
关键词： surface engineering,polar environment,perovskite nanocrystals,encapsulation,stability
更新于2025-09-19 17:15:36
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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via
摘要： A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular, the low-resistivity silicon pillars embedded in the glass cap are designed to serve as the electrical feedthrough and the fixed capacitance plate at the same time to simplify the fabrication process and improve the reliability. The fabrication process and the properties of the encapsulation cap were studied systematically. The resistance of the silicon vertical feedthrough was measured to be as low as 263.5 m?, indicating a good electrical interconnection property. Furthermore, the surface root-mean-square (RMS) roughnesses of glass and silicon were measured to be 1.12 nm and 0.814 nm, respectively, which were small enough for the final wafer bonding process. Anodic bonding between the encapsulation cap and the silicon wafer with sensing structures was conducted in a vacuum to complete the hermetic encapsulation. The proposed packaging scheme was successfully applied to a capacitive gyroscope. The quality factor of the packaged gyroscope achieved above 220,000, which was at least one order of magnitude larger than that of the unpackaged. The validity of the proposed packaging scheme could be verified. Furthermore, the packaging failure was less than 1%, which demonstrated the feasibility and reliability of the technique for high-performance MEMS vacuum packaging.
关键词： vertical interconnect,capacitive,glass reflow,MEMS,3D encapsulation
更新于2025-09-19 17:15:36
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Advanced thin gas barriers film incorporating alternating structure of PEALD-based Al2O3/organic-inorganic nanohybrid layers
摘要： In this work, we reported excellent plasma-enhanced atomic layer deposition (PEALD)-based Al2O3/organic-inorganic (O-I) nanohybrid gas barrier film which exhibits ultralow water vapor transmission rate (WVTR), high activation energy for permeation, high optical transmission in visible light and sufficient flexibility. The values of WVTR and activation energy for permeation of our PEALD-based Al2O3/O-I nanohybrid 4 pair gas barrier film are obtained to be 7.83 × 10?5 g/m2/day (60 °C, 90% RH) and 103.10 kJ/mol via the electrical calcium test. Optical transmission in visible light is 96.14% and critical bending radius 7 mm–9 mm. Introduction of O-I nanohybrid layers between PEALD-based Al2O3 layers improved the properties of gas barrier films on anticorrosion, adhesion, and flexibility.
关键词： Anticorrosion,Encapsulation,Plasma enhanced atomic layer deposition (PEALD),Sol-gel,Nanoparticles,Organic-inorganic nanohybrid,Al2O3
更新于2025-09-19 17:15:36
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Prolonged Lifetime of Perovskite Solar Cells Using a Moisture-Blocked and Temperature-Controlled Encapsulation System Comprising a Phase Change Material as a Cooling Agent
摘要： Although the power conversion efficiency of perovskite solar cells (PSCs) reached up to 25% that made them comparable to the commercial solar cells, they are facing issues toward commercialization, especially their short lifetime. Remarkably, the most important key factors that regulate the durability of the devices are moisture, light, and heat. In this work, prolonging the device lifetime is focused by designing a flexible moisture-blocked and temperature-controlled encapsulation system. In this regard, a thermally adjusted phase change material is embedded in a polymer encapsulation layer to avoid the moisture diffusion, rapid temperature fluctuation, and undesired crystalline phase change of the perovskite layer in the PSCs under the operation condition. As a result, a 2 year stable device is achieved, whereas the reference device loses more than 50% of its performance after 10 days. Surprisingly, the charge transport resistance and recombination rate show no significant change during 450 days of storage, which confirms no increase in the defect density.
关键词： encapsulation system,temperature-controlled,phase change material,perovskite solar cells,lifetime,moisture-blocked
更新于2025-09-19 17:13:59
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Stacked Encapsulation Structure for Discretely Distributed Quantum Dot Array
摘要： The performances of quantum-dot (QD) based photoluminescent devices are highly restricted by the application environment, especially the moisture and oxygen. However, current external encapsulation structures are not applicable to the devices with discrete QD distribution, especially for some rough profiles. To address this issue, an encapsulation method for discretely distributed quantum-dot arrays (DQDA) is proposed for liquid crystal display (LCD) backlight applications, in which the DQDA can be well fabricated by printing the QD slurry onto a light guiding substrate (LGS), and then covered with a thin UV glue layer and a barrier film. By specially optimizing the UV glue and barrier film, this ultra-thin encapsulation structure cannot only improve the surface defects of the QD morphology without affecting the original light path and the output optical performance, but also significantly suppress the fluorescence decay and isolate moisture and oxygen by almost 100 times compared with unencapsulated one. The water vapor transmission rate (WVTR) was measured to be 1.29 × 10?4 g/m2/day after fabricated the stacked encapsulation structure. After a long period of aging test, the encapsulated sample kept its luminance for 1000 hours. This method also has potential to widely used for discrete structures in other device applications due to its easy fabrication process, high reliability, and low manufacturing costs.
关键词： encapsulation,oxygen,stacked structure,moisture,Quantum-dot array
更新于2025-09-19 17:13:59
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[IEEE 2019 IEEE 2nd International Conference on Electronic Information and Communication Technology (ICEICT) - Harbin, China (2019.1.20-2019.1.22)] 2019 IEEE 2nd International Conference on Electronic Information and Communication Technology (ICEICT) - Hybrid Metamaterial Absorber based on the Combination of Plasmonic Structure and Magentic Absorber
摘要： This paper presents a thin-film wafer-level encapsulation process based on an epitaxial deposition seal that incorporates both narrow and wide lateral transduction gaps (0.7–50 μm), both in-plane and out-of-plane electrodes, and does not require release etch-holes in the device layer. Resonant structures fabricated in this process demonstrate high-quality factors ( f × Q products of up to 2.27e + 13 Hz) and exceptional stability (±18 ppb over one month) with no obvious aging trends. Studies on cavity pressure indicate that vacuum levels better than 0.1 Pa can be achieved after final encapsulation, thus reducing gas damping for high surface-to-volume devices. The vast diversity of functioning devices built in this process demonstrates the potential for combinations of high-performance MEMS devices in a single process and/or single chip.
关键词： high stability resonator,Wafer-level encapsulation,high quality factor,low pressure,hermetic encapsulation
更新于2025-09-16 10:30:52
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A review of highly reliable flexible encapsulation technologies towards rollable and foldable OLEDs
摘要： As the demand for flexible, rollable, and foldable displays grows, various state-of-the-art component technologies, including thin-film transistors (TFTs), electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed based on organic light-emitting diodes (OLEDs) with flexible organic layers. Developing highly reliable flexible OLEDs is essential to realize flexible displays, but the flexible encapsulation technology still has technical difficulties and issues to be addressed. This review covers the recent developments in encapsulation technologies, particularly their material and structural designs, for highly reliable, flexible OLEDs. The solution concepts for the existing technical hurdles in flexible encapsulations are addressed. Among the various advanced flexible encapsulation technologies developed so far, neutral-axis engineering with a thin metal layer and a crack arrester is introduced.
关键词： organic light-emitting diode (OLED),Thin-film encapsulation (TFE),foldable,flexible,rollable
更新于2025-09-16 10:30:52
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Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition
摘要： Organic light-emitting diodes (OLEDs) have aroused great attention due to the advantages of high luminescent efficiency, fast response time, wide viewing angle, and the compatibility with the flexible electronics. Nevertheless, the organic luminescent materials are vulnerable to environment moisture/oxygen. Thus, how to protect the OLEDs from the ambient moisture/oxygen erosion is of great importance to ensure the stability and reliability. Thin film encapsulation (TFE) via atomic layer deposition (ALD) has emerged as a potential method to meet the encapsulation requirements of OLEDs due to its unique assets. In this review, the challenges of TFE, including pinholes, crystallization, cracks, and overheated, are introduced first. The ALD-based monolayer, composite structures, and hybrid laminates were developed to improve the barrier property, flexibility, and thermal conductivity. Besides, the ALD reactors and processes for TFE are also reviewed. Finally, the challenges remained and future development in the stabilization of OLEDs via ALD are also discussed.
关键词： flexible electronics,moisture barrier,OLED,thin film encapsulation,atomic layer deposition
更新于2025-09-16 10:30:52
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Perovskite quantum dots for light-emitting devices
摘要： Perovskite quantum dots (QDs) have been hotly pursued in recent decades owing to their quantum confinement effect and defect-tolerant nature. Their unique optical properties, such as high photoluminescence quantum yield (PLQY) approaching unity, narrow emission bandwidth, tunable wavelength spanning the entire visible spectrum, and compatibility with flexible/stretchable electronics, render perovskite QDs promising for next-generation solid lighting sources and information displays. Herein, the advances in perovskite QDs and their applications in LEDs are reviewed. Strategies to fabricate efficient perovskite QDs and device configuration, including material composition design, synthetic methods, surface engineering, and device optimization, are investigated and highlighted. Moreover, the main challenges in perovskite QDs of instability and toxicity (lead-based) are identified, while the solutions undertaken with respect to composition engineering, device encapsulation, and lead-replacement QDs are demonstrated. Meanwhile, perspectives for the further development of perovskite QDs and corresponding LEDs are presented.
关键词： device encapsulation,quantum confinement,Perovskite quantum dots,LEDs,instability,composition engineering,flexible electronics,photoluminescence,lead-replacement,stretchable electronics,toxicity,light-emitting devices
更新于2025-09-16 10:30:52