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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
摘要： A DfR (Design for Reliability) approach which is systematically based on simulation, sensitivity analysis and experimental validation is applied for identifying, understanding and controlling the key factors which determine the solder joint reliability of eWLB (Embedded Wafer Level Ball Grid Array) packages that carry embedded 77 GHz dies and sit on hybrid PCB (Printed Circuit Board) stacks. The hybrid stack investigated in this work is characteristic to automotive RADAR (Radio Detection And Ranging) applications and consists of one low-loss RF (Radio Frequency) layer and several FR4 layers. In line with previous work [1], the mechanical material properties of the low-loss RF laminate material are found to be the key factor. Simulation is used to systematically screen for mechanical properties which are favorable for achieving a high solder joint reliability on the unconstrained PCBs used for standardized solder joint reliability testing. A simplified virtual assessment of PCBs constrained by the mounting in system module housings is done. Both simulation and experimental results show that RF laminate materials with low Young’s modulus are the class of materials which allows for the highest solder joint reliability for all the conditions investigated in this study.
关键词： RF laminate,Design for Reliability,eWLB,solder joint reliability,automotive RADAR
更新于2025-09-10 09:29:36
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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications
摘要： FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduces the total form factor all in a cost-effectiveness format. FOWLP volumes have largely been driven by mobile and consumer applications (RF, BB, connectivity, NFC, PMIC, audio codec, MCU etc) and are now moving to 5G communication, mmWave, automotive, MEMS/Sensor and IoT/WE applications. Advanced embedded Wafer Level Ball Grid Array (eWLB) provides a versatile platform for the semiconductor industry’s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. WLP (wafer level packaging) has already been adopted in the automotive market for cabin or infotainment applications as well as 77GHz radar sensors utilizing FO-WLP. This study focuses on the development of eWLB for mmWave applications above 60GHz with CMOS IC technology. Additionally the case study of 77GHz ADAS automotive radar is discussed. Package design optimization of single-die and multi-die, electrical performance characterization and component level reliability tests are presented.
关键词： Reliability,FOWLP,mmWave,Automotive packaging,77GHz ADAS packaging,eWLB
更新于2025-09-04 15:30:14