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<i>In Situ</i> Characterization of the Triphase Contact Line in a Brush-Coating Process: Toward the Enhanced Efficiency of Polymer Solar Cells
摘要： Solution processes have been widely used for making polymer ?lms in organic photoelectric devices but su?er from di?culties in controlling the ?lm formation. Here, by in situ characterization triphase contact lines (TCLs) in a brush-coating process, we clarify how TCLs a?ect the quality of as-prepared ?lms. By ?ne-tuning the dewetting of a binary polymer solution (P3HT:PCBM) via di?erent directions, TCLs with di?erent patterns lead to ?lms with di?erent morphologies. High-quality nanothin ?lms with larger crystallized sizes and higher orientations were enabled when TCLs were parallel to the brush edge, based on which the polymer solar cell shows higher power conversion e?ciency (2.665%) compared with that of the spin-coated ?lm.
关键词： in situ characterization,the Chinese brush,dewetting,triphase contact line,polymer ?lms
更新于2025-09-23 15:21:01
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Understanding the Importance of Cu(I) Intermediates in Self-Reducing Molecular Inks for Flexible Electronics
摘要： Fast and scalable low-temperature deposition of microscale metallic features is of utmost importance for the development of future flexible smart applications including sensors, wireless communication, and wearables. Recently, a new class of metal?organic decomposition (MOD) copper inks was developed, consisting of formate containing amine complexes. From these novel inks, features with outstanding electrical conductivity (±105 S cm?1) are deposited at a temperature of 150 °C or less, which is well below the reduction temperature of orthorhombic α-copper formate (around 225 °C). However, the underlying principle of this reaction mechanism and the relationship between the corresponding temperature shift and the amine coordination are still under debate. The current study provides a full explanation for the shift in reduction temperatures via in situ characterization. The results clearly indicate that the structural resemblance and stability of the Cu(II) starting compound and the occurring Cu(I) intermediate during the in situ reduction are the two main variables that rationalize the temperature shift. As such, the thermal compatibility of copper MOD inks with conventional plastic substrates such as polyethylene terephthalate can be explained, based on metal?organic complex properties.
关键词： metal?organic decomposition,copper inks,in situ characterization,self-reducing,flexible electronics
更新于2025-09-09 09:28:46