- 标题
- 摘要
- 关键词
- 实验方案
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[IEEE 2019 Compound Semiconductor Week (CSW) - Nara, Japan (2019.5.19-2019.5.23)] 2019 Compound Semiconductor Week (CSW) - Multi-wavelength DFB laser array in InAs/GaAs quantum dot material epitaxially grown on Silicon
摘要： A ?rst proof-of-concept mm-sized implantable device using ultrasonic power transfer and a hybrid bi-directional data communication link is presented. Ultrasonic power transfer enables miniaturization of the implant and operation deep inside the body, while still achieving safe and high power levels (100 W to a few mWs) required for most implant applications. The current implant prototype measures 4 mm 7.8 mm and is comprised of a piezoelectric receiver, an IC designed in 65 nm CMOS process and an off-chip antenna. The IC can support a maximum DC load of 100 W for an incident acoustic intensity that is 5% of the FDA diagnostic limit. This demonstrates the feasibility of providing further higher available DC power, potentially opening up new implant applications. The proposed hybrid bi-directional data link consists of ultrasonic downlink and RF uplink. Falling edge of the ultrasound input is detected as downlink data. The implant transmits an ultra-wideband (UWB) pulse sequence as uplink data, demonstrating capability of implementing an energy-ef?cient M-ary PPM transmitter in the future.
关键词： implantable biomedical devices,active recti?er,mm-sized implants,ultrasonic power transfer,piezoelectric receivers,bi-directional data communication,CMOS,antennas,IMD,AC-DC converter,radio transmitters
更新于2025-09-19 17:13:59
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[IEEE 2019 IEEE 4th International Conference on Image, Vision and Computing (ICIVC) - Xiamen, China (2019.7.5-2019.7.7)] 2019 IEEE 4th International Conference on Image, Vision and Computing (ICIVC) - A Method for Generating Spray Trajectory of a Shoe Sole Based on Laser Vision
摘要： A ?rst proof-of-concept mm-sized implantable device using ultrasonic power transfer and a hybrid bi-directional data communication link is presented. Ultrasonic power transfer enables miniaturization of the implant and operation deep inside the body, while still achieving safe and high power levels (100 W to a few mWs) required for most implant applications. The current implant prototype measures 4 mm 7.8 mm and is comprised of a piezoelectric receiver, an IC designed in 65 nm CMOS process and an off-chip antenna. The IC can support a maximum DC load of 100 W for an incident acoustic intensity that is 5% of the FDA diagnostic limit. This demonstrates the feasibility of providing further higher available DC power, potentially opening up new implant applications. The proposed hybrid bi-directional data link consists of ultrasonic downlink and RF uplink. Falling edge of the ultrasound input is detected as downlink data. The implant transmits an ultra-wideband (UWB) pulse sequence as uplink data, demonstrating capability of implementing an energy-ef?cient M-ary PPM transmitter in the future.
关键词： piezoelectric receivers,bi-directional data communication,mm-sized implants,CMOS,ultrasonic power transfer,active recti?er,IMD,antennas,radio transmitters,AC-DC converter,implantable biomedical devices
更新于2025-09-19 17:13:59