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Facile and Green Synthesis of Graphene-Based Conductive Adhesives via Liquid Exfoliation Process
摘要： In this study, we report a facile and green process to synthesize high-quality and few-layer graphene (FLG) derived from graphite via a liquid exfoliation process. The corresponding characterizations of FLG, such as scanning electron microscopy (SEM), transmission electron microscope (TEM), atomic force microscopy (AFM) and Raman spectroscopy, were carried out. The results of SEM show that the lateral size of as-synthesized FLG is 1–5 μm. The results of TEM and AFM indicate more than 80% of graphene layers is <10 layers. The most surprising thing is that D/G ratio of graphite and FLG are 0.15 and 0.19, respectively. The result of the similar D/G ratio demonstrates that little structural defects were created via the liquid exfoliation process. Electronic conductivity tests and resistance of composite ?lm, in terms of different contents of graphite/polyvinylidene di?uoride (PVDF) and FLG/PVDF, were carried out. Dramatically, the FLG/PVDF composite demonstrates superior performance compared to the graphite/PVDF composite at the same ratio. In addition, the post-sintering process plays an important role in improving electronic conductivity by 85%. The composition-optimized FLG/PVDF thin ?lm exhibits 81.9 S·cm?1. These results indicate that the developed FLG/PVDF composite adhesives could be a potential candidate for conductive adhesive applications.
关键词： conductive adhesives,liquid exfoliation,graphene,?exiable,polyvinylidene ?uoride
更新于2025-09-23 15:23:52
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Novel Foil Interconnects for Back-Contact Silicon Solar Cells
摘要： Large area back-contact solar cells enable module costs almost as low as those of PERCs but with higher efficiency. Traditional tabbing and stringing interconnects are problematic for back-contact cells, however, as placing all the tabs on one side of the wafer causes bowing due to CTE mismatch. Back-contact cells can be effectively encapsulated using Cu conductive back-sheets (CBS) with electrically conductive adhesive (ECA) interconnects but the cost is higher than for ribbon tabbing. In this paper we present a method for replacing the Cu CBS with a cheaper Al version and the ECA with several cheaper and potentially more robust methods for connecting the foil to the cell.
关键词： laser welding,conductive adhesives,reliability,Back-contact modules,aluminum interconnects,conductive back-sheets
更新于2025-09-19 17:13:59
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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Highly conductive, flexible PU/PANI based conductive adhesives for flexible electronics
摘要： Composite matrix material based on polyurethane (PU) and polyaniline (PANI) were synthesized via a simple process. The composite material and the silver flakes were used as matrix and filler, respectively. Resistivity can be achieved as low as 3.8×10-5 Ω?cm at 70 wt.% loadings, suggesting good conductive properties. The conductivity of the electrical conductive adhesive sample was basically unchanged after 400 cycles of bending and 1000 cycles of twisting. The flexible electrical conductive adhesives (FECAs) possess not only superior electrical conductivity with good stability even under bending. These superior material properties combined with excellent performance and simple processing make it very promising for emerging flexible electronics.
关键词： matrix,electrical conductive adhesives,flexible electronics
更新于2025-09-10 09:29:36