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Microstructure and mechanical properties of Ti/Al dissimilar joints produced by laser-MIG welding–brazing
摘要： We butt-welded AA6061 aluminum alloy to Ti6Al4V titanium alloy, dissimilar light metals, by using laser-MIG hybrid welding–brazing without grooves. The parameters of the laser and arc were optimized to produce sound joints with good formation and mechanical properties. The microstructure of the layer of intermetallic compounds (IMCs) was investigated by scanning electron microscopy and energy dispersive spectroscopy. We also tested the tensile strength of the joints with and without reinforcement. The morphology and thickness of the IMCs varied throughout the joints. A continuous thin layer of TiAl3 appeared on the top surface of the Ti6Al4V, on which some rod-like IMCs grew toward the fusion zone. In the upper region of the butt plane, because more heat accumulated there from the high-power laser coupled with the MIG arc, double-layer IMCs with a thickness of ～ 10.0 μm formed, composed of TiAl (near the Ti alloy) and TiAl3 (near the fusion zone). In the lower region of the butt plane, the double-layer IMCs became continuous and uniform, the serrated morphology disappeared, and the thickness of the IMC layer decreased to 4.0 μm. On the backside of the joint, the thickness of the compound layer (TiAl3) was about 1.0 μm. The average tensile strengths of the reinforced and unreinforced joints were 226 MPa and 210 MPa, respectively, which are up to 88% and 81% of the AA6061 tensile strength, respectively.
关键词： dissimilar joint,titanium alloy,intermetallic compounds.,Laser-MIG hybrid welding–brazing,aluminum alloy
更新于2025-09-23 15:22:29
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Wetting and spreading behaviors of Al-Si alloy on surface textured stainless steel by ultrafast laser
摘要： An ultrafast laser was used to ablate the surface of stainless steel. Periodical surface micro-textures including micro-grooves, micro-pits and micro/nano-ripples were successfully fabricated. As a typical reactive wetting system, Al-Si alloy was used to study the wetting and spreading behaviors on the laser patterned surfaces of stainless steel. The results showed that initial, rapid spreading and gradient balance stages were found in the spreading process. By comparing to the primitive surface, Al-Si alloy exhibited worse wettability on the surface with micro-grooves and micro-pits because of the geometrical characteristics and nano-scale oxides residuals after laser processing; however, Al-Si alloy showed better wettability on the surface with micro/nano-ripples owing to the formation of micro/nano hierarchically patterns and the resultant improved capillary actions. The interfacial reaction layer formed during wetting and spreading processes were also investigated. The surface micro-textures were found to enhance the interfacial metallurgical reactions, thus increasing the thickness of the reaction layer. This work provides a new method to improve the wettability, spreadability and metallurgical reactions of Al-Si/stainless steel reactive wetting system and may extend its use in other reactive wetting systems. This method may be able to improve brazing, soldering, coating and other processes involving solid/liquid interfacial interactions.
关键词： Reactive wetting system,Wetting and spreading,Intermetallic compounds,Ultrafast laser processing,Surface micro-textures
更新于2025-09-23 15:21:01
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Design of laser welding applied to T joints between steel and aluminium
摘要： Laser conduction welding was used to directly join DH36 steel to AA5083 aluminium alloy in a T joint configuration, each plate with 6 mm of thickness. The effect of the process energy (via power density and interaction time) on the joint integrity and quality in terms of cracking, porosity and intermetallic compound layer formation was investigated. Successful T joints were produced by melting of the aluminium plate, which was inserted into a 4 mm deep groove machined on the steel plate, with the heat generated by the laser irradiation on the steel surface. The IMC layer thickness was less than 5 μm. Although cracking was observed along the IMC layer with higher levels of energies, the joints were still strong due to the mechanical inter-locking effect resulting from the novel design of the component, whereby the IMCs were subjected to compressive state of stress while loading.
关键词： Aluminium,Dissimilar metal joining,Steel,Joint design,Laser welding,T joint,Intermetallic compounds
更新于2025-09-19 17:13:59
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Low Conductivity Decay of Sn–0.7Cu–0.2Zn Photovoltaic Ribbons for Solar Cell Application
摘要： The present study applied Sn–0.7Cu–0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after re?ow. Electron probe microanalyzer images showed that a Cu–Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn–0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn–0.7Cu–0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn–0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.
关键词： photovoltaic ribbon,Sn–0.7Cu–0.2Zn,intermetallic compounds,Zn accumulation layer
更新于2025-09-12 10:27:22
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The Quest for Zero Loss: Unconventional Materials for Plasmonics
摘要： There has been an ongoing quest to optimize the materials used to build plasmonic devices: first the elements were investigated, then alloys and intermetallic compounds, later semiconductors were considered, and, most recently, there has been interest in using more exotic materials such as topological insulators and conducting oxides. The quality of the plasmon resonances in these materials is closely correlated with their structure and properties. In general gold and silver are the most commonly specified materials for these applications but they do have weaknesses. Here, it is shown how, in specific circumstances, the selection of certain other materials might be more useful. Candidate alternatives include TixN, VO2, Al, Cu, Al-doped ZnO, and Cu–Al alloys. The relative merits of these choices and the many pitfalls and subtle problems that arise are discussed, and a frank perspective on the field is provided.
关键词： plasmonics,conducting oxides,topological insulators,intermetallic compounds,figure-of-merit,material selection
更新于2025-09-11 14:15:04
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Influence of electrodeposited Cu-Ni layer on interfacial reaction and mechanical properties of laser welded-brazed Mg/Ti lap joints
摘要： A fiber laser welding-brazing procedure has been developed for joining AZ31B magnesium alloy to Cu-Ni coated Ti-6Al-4V titanium sheet using AZ92D filler wire. The effect of the interlayer arrangements (AZ31B/Ni-Cu/Ti-6Al-4V and AZ31B/Cu-Ni/Ti-6Al-4V) on appearance, interfacial reaction and mechanical properties were investigated at different heat input. It was found that the feasibility of this process depends strongly on the pre-existing Cu-Ni layer on the Ti surface that promotes wetting of the AZ92 filler. Within the range of 1200–1600 W, defect free joints in both interlayer arrangements. Depending on the interlayer arrangements chosen, different reactions layers formed inside the joint region. Nevertheless, at optimum heat input (1400 W), Ti2Ni mingled with Ti3Al interfacial reaction products was produced along the fusion zone (FZ)-Ti brazed interface in both interlayer arrangements. The tensile-shear fracture load of the joints produced at the optimum laser power reached a maximum value of 2016.5 N for AZ31B/Ni-Cu/Ti-6Al-4V and 2014.6 N for AZ31B/Cu-Ni/Ti-6Al-4V, representing an efficiency of 71% compared to AZ31B alloy. Under suitable heat input, the joints failed at the fusion zone of the AZ31B base metal. In contrast, incomplete brazing or large volume of intermetallics at the brazed interface resulted in interfacial failure at lower/higher heat input.
关键词： Laser welding-brazing,Mg alloy,Intermetallic compounds (IMCs),Ti alloy,Microstructure
更新于2025-09-10 09:29:36
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AIP Conference Proceedings [Author(s) SolarPACES 2017: International Conference on Concentrating Solar Power and Chemical Energy Systems - Santiago, Chile (26–29 September 2017)] - Influence of indium addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate
摘要： This work investigates the effect of Indium (In) addition, 0.5 wt.% In, on the wettability of the Sn–3Ag–0.5Cu (SAC305) ternary pb-free solder alloy. Adding In to SAC305 decreased the contact angles (θ) of the Sn-2.5Ag-0.5Cu-0.5In quaternary pb-free solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The results indicated that when the addition of In was 0.5 wt.%, the change in melting temperature of Sn–2.5Ag-0.5Cu–0.5In solder was negligible, but the contact angles (θ) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest θ was obtained as 45.22° for Sn–2.5Ag-0.5Cu– 0.5In alloy at 310 °C. The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed. Thus, If the amounts of indium and silver are optimized, the Sn-2Ag-0.5Cu-0.5In quaternary solder alloy may be a suitable potential candidate to replace conventional Sn-3.0Ag-0.5Cu solder to provide economic gain in solder alloy production.
关键词： Indium addition,Sn-3Ag-0.5Cu solder alloy,Cu substrate,wettability,intermetallic compounds
更新于2025-09-04 15:30:14