[IEEE 2018 IEEE 22nd International Conference on Intelligent Engineering Systems (INES) - Las Palmas de Gran Canaria, Spain (2018.6.21-2018.6.23)] 2018 IEEE 22nd International Conference on Intelligent Engineering Systems (INES) - High Resolution 3D Thermal Imaging Using FLIR DUO R Sensor

摘要： With the spread of photogrammetry processes, photo-based 2D/3D reconstruction became general, in research as well as in the industry. Source images are taken using either a hand-held camera or an automated camera fixed to the carrier, a UAV, then they are matched during post-processing. The price of digital microbolometer-based high-resolution (1 megapixel) thermal cameras is currently very high, but these, compared to RGB cameras (16-20 megapixel), are still considered to have very low-resolution, in this way employing photogrammetry in this present case is not feasible. In the article, a novel method developed by us is introduced which by using a low thermal resolution camera (FLIR DUO R), based on which a 3D thermal image can be produced with the help of a camera capable of dual imaging (RGB and Thermal). The work is illustrated using measurements, and post-production was conducted using the MATLAB software. The process is adequate for producing 3D thermal images taken using UAV devices.