[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Innovative System in Package Design by Laser Ablation Technology

摘要： The 5G revolution brings a lot innovative impact in various applications and business opportunities in mobility, automotive, insdustrial automation and healthcare globally. Therefore, the muti-function integration, form factor miniaturization and time to market of IC package design become the necessary trend in electronic assembly technology. Obviously, system in package (SiP) is the capable solution to meet these requirments and widely applied in the IOT, automotive and sensor module currently. However, the conventional singulation process by blade sawing technology exists the burr residual, inflexible package shape forming and inaccuracy tolerance controlling challenges that brings about low yield and limited package shape design. In this research, the sigulation and metal lid by laser ablation technology in various system in package applications are demonstrated, the metal lid discoloration and burr residual defeat are successfully eliminated by pico second pulses laser technology which shorten the energy absorption time from laser light to electrons and improve the heat-affected zone (HAZ) damage on sawing edge during the ablation process. Therefore, the design of experiment (DOE) shows that the metal lid discoloration rate have been greatly improved from 25% to 0% and without the burr residual issue by utilizing UV laser ablation process. In addition, the package shape forming by UV laser is also studied in this paper, the various geometrical shape that including circle, hexagon and qctagon package appearance are fabricated within 30 um cutting tolerance while without any chipping residual on cutting edge, thus, this formnig technology have been widely applied in various fingerprint sensor and particular module applications in smartphone and automotive industry. The typical reliability testing (Temperature Cycle Test, Hight Temperature Storage Test and unbias HAST) results as a verification. By employing this advanced UV laser ablation technology, the package forming quality and sawing accuracy control can be improved obviously compare to the topically blade sawing process. Undoubtedly, the UV laser ablation with pico pluse technology is absolutely the innovative and powerful weapon to accomplish the high quality SiP design in 5G generation.