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[IEEE 2018 International Power Electronics Conference (IPEC-Niigata 2018 –ECCE Asia) - Niigata, Japan (2018.5.20-2018.5.24)] 2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia) - Optimized Selection and Utilization of DC-Link Capacitor in a Single-Phase PV Grid Inverter System
摘要： Single-phase PV grid inverters usually require large reservoir capacitors on the DC-Link to absorb 2nd order harmonics. This paper shows in a design how to improve the utilization of metalized polypropylene film capacitor (MPFC) specifications in multiple dimensions simultaneously: break-down voltage rating, capacitance, ripple current capability and warranted reliability performance. As a result, the system size and cost can be reduced, while the overall energy capturing efficiency is guaranteed. Under low-capacitance conditions the DC-Link voltage varies within a fundamental cycle; a boost converter is placed between the PV panel and the DC-Link to provide MPPT (maximum power point tracking). The modulation index of the output inverter can be dynamically varied for waveform compensation. Comparison is made with electrolytic capacitors and it is found that when using an optimized capacitor selection strategy, it is possible to mitigate the increased size and cost implications of film capacitors. Simulation demonstrates the design of a 2.5kW system, while experiment is conducted to prove the design concept.
关键词： size reduction,metalized polypropylene film capacitor,reliability,cost,PV inverter
更新于2025-09-09 09:28:46
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Analysis of Forward Surge Performance of SiC Schottky Diodes
摘要： Silicon Carbide JBS diodes are capable, in forward bias, of carrying surge current of magnitude significantly higher than their rated current, for short periods. In this work, we examine the mechanisms of device failure due to excess surge current by analyzing variation of failure current with device current and voltage ratings, as well as duration of current surge. Physical failure analysis is carried out to correlate to electrical failure signature. We also quantify the impact, on surge current capability, of the resistance of the anode ohmic contact to the p-shielding region.
关键词： MPS,JBS,SiC,Diode,Surge,SBD,Silicon Carbide,Schottky,Reliability
更新于2025-09-09 09:28:46
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[IEEE 2018 7th International Conference on Renewable Energy Research and Applications (ICRERA) - Paris, France (2018.10.14-2018.10.17)] 2018 7th International Conference on Renewable Energy Research and Applications (ICRERA) - Mission Profile Impact on Capacitor Reliability in PV Single-Stage Inverters
摘要： This paper presents an analysis of how the photovoltaic mission profile affects electro-thermal performance and lifetime of DC-link capacitors of a single-stage inverter. A multi-step methodology is proposed to evaluate how different climate conditions impact on a various number of variables and elements of a PV system. Two PV mission profiles in different climate regions – a tropical and a temperate one – are defined using real weather data and combined with a PV model in order to obtain the relevant values of power processing throughout a 1-year operation. Electro-thermal modeling of DC-link capacitors in a single-stage PV inverter is done in order to evaluate their operating conditions in time. Finally, an analysis of the system’s behavior for each mission profile is presented along with a lifetime analysis of the DC-link capacitors. The results demonstrate that the proposed methodology enables to verify, under several system levels, how the mission profiles affect capacitor lifetime in PV inverters.
关键词： Capacitor lifetime,PV mission profile,PV inverter,DC-link Reliability
更新于2025-09-09 09:28:46
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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications
摘要： FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduces the total form factor all in a cost-effectiveness format. FOWLP volumes have largely been driven by mobile and consumer applications (RF, BB, connectivity, NFC, PMIC, audio codec, MCU etc) and are now moving to 5G communication, mmWave, automotive, MEMS/Sensor and IoT/WE applications. Advanced embedded Wafer Level Ball Grid Array (eWLB) provides a versatile platform for the semiconductor industry’s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. WLP (wafer level packaging) has already been adopted in the automotive market for cabin or infotainment applications as well as 77GHz radar sensors utilizing FO-WLP. This study focuses on the development of eWLB for mmWave applications above 60GHz with CMOS IC technology. Additionally the case study of 77GHz ADAS automotive radar is discussed. Package design optimization of single-die and multi-die, electrical performance characterization and component level reliability tests are presented.
关键词： Reliability,FOWLP,mmWave,Automotive packaging,77GHz ADAS packaging,eWLB
更新于2025-09-04 15:30:14
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Fast discrimination of bacteria using a filter paper–based SERS platform and PLS-DA with uncertainty estimation
摘要： Rapid and reliable identification of bacteria is an important issue in food, medical, forensic, and environmental sciences; however, conventional procedures are time-consuming and often require extensive financial and human resources. Herein, we present a label-free method for bacterial discrimination using surface-enhanced Raman spectroscopy (SERS) and partial least squares discriminant analysis (PLS-DA). Filter paper decorated with gold nanoparticles was fabricated by the dip-coating method and it was utilized as a flexible and highly efficient SERS substrate. Suspensions of bacterial samples from three genera and six species were directly deposited on the filter paper–based SERS substrates before measurements. PLS-DA was successfully employed as a multivariate supervised model to classify and identify bacteria with efficiency, sensitivity, and specificity rates of 100% for all test samples. Variable importance in projection was associated with the presence/absence of some purine metabolites, whereas confidence intervals for each sample in the PLS-DA model were calculated using a resampling bootstrap procedure. Additionally, a potential new species of bacteria was analyzed by the proposed method and the result was in agreement with that obtained via 16S rRNA gene sequence analysis, thereby indicating that the SERS/PLS-DA approach has the potential to be a valuable tool for the discovery of novel bacteria.
关键词： Chemometrics, partial least squares discriminant analysis,Surface-enhanced Raman spectroscopy,Reliability estimation,16S rRNA gene sequence analysis,Gold nanoparticles
更新于2025-09-04 15:30:14
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The reliability of solar energy generating system with inverters in series under common cause failure
摘要： With the shortage of nonrenewable energy, renewable energy resources play an important role in practice. One of the most promising renewable energy is viewed as solar energy resources due to its cleanliness and the inexhaustibility. However, the quantitative assessment method on the reliability of a complicated solar energy generating system has been a considerable challenge. In this paper, we propose a Markov model to imitate a solar energy generating system with inverters in series, unreliable by-pass change-over switches, and common cause failure. Employing the renewal point technique and the Semi-Markov process theory, we build the quantitative reliability models of the system. Further, we develop a new algorithm to obtain the explicit form solution of reliability indices. An example illustrates that the proposed models and the algorithm are e?cient and concise.
关键词： Common cause failure,Switch failure,Micro-inverters,Reliability,Solar energy generating system
更新于2025-09-04 15:30:14
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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices
摘要： As the efficiency of power electronics becomes more important, the use of silicon carbide (SiC) devices in power electronics has shown several benefits in efficiency, blocking voltage and high temperature operation. In addition, the ability of SiC to operate at higher frequencies due to lower switching losses can result in reduced weight and volume of the system, which also are important factors in vehicles. However, the reliability of packaged SiC devices is not yet fully assessed. Previous work has predicted that the different material properties of SiC compared to Si could have a large influence on the failure mechanisms and reliability. For example, the much higher elastic modulus of SiC compared to Si could increase strain on neighboring materials during power cycling. In this work, the failure mechanisms of packaged Si- and SiC-based power devices have been investigated following power cycling tests. The packaged devices were actively cycled in 4.5 s heating and 20 s cooling at ΔT = 60 - 80 K. A failure analysis using micro-focus X-ray and scanning acoustic microscopy (SAM) was carried out in order to determine the most important failure mechanisms. The results of the analysis indicate that the dominant failure mechanism is wire bond lift-off at the device chip for all of the SiC-based devices. Further analysis is required to determine the exact failure mechanisms of the analyzed Si-based devices. In addition, the SiC-based devices failed before the Si-based devices, which could be a result of the different properties of the SiC material.
关键词： power cycling,SiC,power electronics,failure mechanisms,reliability
更新于2025-09-04 15:30:14
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[IEEE 2018 13th European Microwave Integrated Circuits Conference (EuMIC) - Madrid, Spain (2018.9.23-2018.9.25)] 2018 13th European Microwave Integrated Circuits Conference (EuMIC) - Fully Automated RF-Thermal Stress Workbench with S-Parameters Tracking for GaN Reliability Analysis
摘要： The rapid development of III-V technologies for telecommunication and radar markets need the meeting of performances (power, frequency) criteria as well as reliability assessment. Nitride HEMT technologies are known to reveal a large variety of failure electrical signatures, and it is also largely accepted that multi-tools (multi physics) approaches is the only suitable way to understand the failure mechanisms and to improve the technologies. Experimental stress workbenches usually allow to track a given number of static/dynamic parameters, but specific characterization are only performed at initial and final steps on the devices. This paper proposes a new approach with S-parameters measurement performed during RF stresses without removing the devices under test (in a thermally controlled oven). Then intermediate knowledge of the electrical (small signal) behavior of the devices can be assessed, and crossed with large-signal and static time-dependent signatures.
关键词： Microwave transistors,HEMTs,Gallium nitride,Life testing,C-band,Semiconductor device reliability
更新于2025-09-04 15:30:14
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[IEEE 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) - San Diego, CA, USA (2018.10.15-2018.10.17)] 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) - Revisiting Safe Operating Area: SiGe HBT Aging Models for Reliability-Aware Circuit Design
摘要： This paper presents and validates a physics-based compact aging model for predictive simulation of hot-carrier degradation in SiGe HBTs. Separate aging functions model the effects of high-field mixed-mode and high-current Auger-hot-carrier stresses and are integrated together to provide predictive capability across a wide bias range. The variation of aging rate with device geometry and the incorporation of multiple parameter shifts due to hot carrier polysilicon degradation are explored. Additionally, aging simulation results of a driver circuit are presented to begin to demonstrate how such models may be incorporated as part of the circuit design process.
关键词： SiGe HBT,safe operating area,mixed-mode stress,high-current stress,reliability
更新于2025-09-04 15:30:14
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[IEEE 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Portland, OR, USA (2018.9.23-2018.9.27)] 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Reliability Assessment of PV Inverters with Battery Systems Considering PV Self-Consumption and Battery Sizing
摘要： To ensure the cost-competitiveness of Photovoltaic (PV) with integrated Battery Energy Storage Systems (PV-BESS), a highly reliable operation is demanded. The PV inverter has been reported as one of the reliability-critical components in the system, whose failures can lead to a severe negative impact on the cost of PV energy. Therefore, improving PV inverter reliability has high potential for the cost reduction of the PV-BESS. This paper thus investigates the impact of battery operation on the PV inverter reliability. A 6-kW residential PV-BESS in Germany is considered, where a self-consumption scheme is adopted. The evaluation results reveal that the reliability of the PV inverter is strongly affected by the battery operation. More specifically, the PV inverter loading is decreased significantly during the battery charging, which results in an improvement in the PV inverter reliability. In addition, the battery system parameters, such as battery capacity and battery converter power rating, also affect the PV inverter loading, whose impact on the PV inverter reliability has been analyzed.
关键词： battery,self-consumption,mission profile,lifetime,PV inverters,reliability
更新于2025-09-04 15:30:14