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Investigation on Ag-containing compound generated in manufacturing of low-temperature polycrystalline Si active matrix organic light-emitting diode
摘要： In this work, we report a systematic investigation on Ag-containing compound widely generated in anode wet etching process of low-temperature polycrystalline Si active matrix organic light-emitting diode (LTPS-AMOLED). The formation mechanism of the aforementioned compound was proposed and confirmed by sufficient evidence. The relevant test results show that, unlike traditional metal compounds, this compound cannot be removed by aqueous oxalic acid solution. Furthermore, the reported Ag-containing compounds grow and migrate in response to electric fields in high-temperature and high-humidity environment (85°C, 85% humidity) to short neighboring integrated circuit pads, causing severe product reliability failure. Spectra test results indicate that products with reliability failure are characterized by reduced display brightness and shifted color coordinates. To improve the reliability failure caused by Ag-containing compounds, five potential schemes are presented, and most of them are conducted in this study.
关键词： reliability failure,LTPS-AMOLED,Ag-containing compound,responding to electric fields
更新于2025-09-23 15:21:01
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Nuevo enfoque para la localización óptima de reconectadores en sistemas de distribución considerando la calidad del servicio y los costos de inversión
摘要： This article presents a new methodology for the optimal placement of reclosers on electric power distribution systems. The methodology simultaneously considers the installation of reclosers normally closed and open, in order to fault isolation and service restoration, respectively. The problem is described by a multi-objective mathematical model, where the first objective function minimizes the unserved energy level of the system (NENS) and the second one minimizes the investment costs of the project. The set of constraints considers operational criteria of the system. As a solution strategy the concept of operational areas is introduced, which reduce computational effort considering that the NENS by area remains constant. In the problem solution, a Non-dominated Sorting Genetic Algorithm II (NSGA-II) is employed. The results show the validity of the proposed methodology and its applicability to real distribution systems.
关键词： distribution systems,NSGA-II Algorithm,reclosers,reliability,multi-objective optimization
更新于2025-09-23 15:21:01
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[IEEE 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Bochum, Germany (2019.7.16-2019.7.18)] 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - New approach for the simulation of bent and crumpled antennas on a flexible substrate
摘要： First-ever 28 nm embedded split-gate MONOS (SG-MONOS) ?ash macros have been developed to increase memory capacity embedded in micro controller units and to improve performance over wide junction temperature range from C to 170 C as demanded strongly in automotive uses. Much attention has been paid to the degradation of the reliability characteristics along with the process shrinkage. Temperature-adjusted word-line overdrive scheme improves random read access frequency by 15% and realizes both of 6.4 GB/s read throughput by 200 MHz no-wait random access of code ?ash macros and more than ten times longer TDDB lifetime of WL drivers. Temperature-adaptive step pulse erase control (TASPEC) improves the TDDB lifetime of dielectric ?lms between metal interconnect layers by three times. TASPEC is particularly useful for a data ?ash macro with one million rewrite cycles. Source-side injection (SSI) program with negative back-bias voltage achieves 63% reduction of program pulse time and, consequently, realizes 2.0 MB/s write throughput of code ?ash macros. A spread spectrum clock generation and a clock phase shift technique are introduced for charge pump clock generation in order to suppress EMI noise due to high write throughput of code ?ash macros, and peak power of EMI noise is reduced by 19 dB.
关键词： high reliability,spread spectrum clock generation,word-line overdrive,Automotive application,split-gate MONOS(SG-MONOS),embedded ?ash memory,time dependent dielectric breakdown,high-temperature operation,Fast random read operation
更新于2025-09-23 15:19:57
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[IEEE 2019 International Conference on Electrical, Electronics and Computer Engineering (UPCON) - ALIGARH, India (2019.11.8-2019.11.10)] 2019 International Conference on Electrical, Electronics and Computer Engineering (UPCON) - A Study on the Influence of Open Circuit Voltage (Voc) and Short Circuit Current (Isc) on Maximum Power Generated in a Photovoltaic Module/Array
摘要： A technique is described, to efficiently evaluate the reliability of an RF semiconductor device when several different mechanisms contribute simultaneously to its wearout. This is of interest for present-day GaN HEMT devices because symptoms of several simultaneous degradation mechanisms have been reported widely. The technique involves first finding DC parameters that are “signatures” of each mechanism. Then, separate DC-stress lifetests are performed to find the degradation rates for the signature parameters, at several temperatures, and the corresponding Arrhenius curves. Next, an RF-stress lifetest (with only one stress condition) is performed, while monitoring all of the signature parameters and the RF performance. This is utilized to determine the “scaling factors” between the rates of change in the DC lifetests and the rates of change in the RF application. Applying these scaling factors to the original Arrhenius curves gives an “overall” Arrhenius plot for the RF application with several different lines, for the different degradation mechanisms. The technique can be extended to further degradation mechanisms, by conducting further DC and RF lifetests while monitoring appropriate signature parameters.
关键词： semiconductor device reliability,lifetesting,gallium nitride,HEMTs,Failure analysis
更新于2025-09-23 15:19:57
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[IEEE IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society - Lisbon, Portugal (2019.10.14-2019.10.17)] IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society - Sensorless Current Control of Large-Scale LED Lighting Systems based on SIMO LED Drivers
摘要： Most of the state-of-the-art LED drivers employed in lighting applications adopt current control strategies that rely on current sensing resistors. In multi-string LED lighting systems, commonly based on the single inductor multiple output (SIMO) topology, a current sensing resistor is typically inserted in each string, allowing to precisely control the current flowing through each string. This current control approach presents critical drawbacks: 1) the overall energy conversion efficiency is seriously affected by the fairly high number of current sensing resistors; 2) the system complexity is enhanced, as each LED string requires a current control loop; 3) the lifetime of both LEDs and drivers suffers an important depreciation due to the additional power losses incurred by the current sensing resistors. To overcome such drawbacks, this paper proposes a sensorless current control strategy suitable for LED drivers operated at continuous conduction mode (CCM), feeding multi-string LED lighting systems, which obviates the requirement of individual string current control. The proposed control strategy is implemented and validated on a fault-tolerant SIMO LED driver.
关键词： DC-DC converters,Sensorless control,LED lighting,Reliability,Efficiency
更新于2025-09-23 15:19:57
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Servo control system based on optical fiber CAN communication
摘要： Aiming at the problem that the long-distance transmission of CAN bus in the servo control system is susceptible to electromagnetic interference, a servo control scheme based on optical fiber CAN bus was proposed to solve the problem of stable and reliable communication of CAN bus. Firstly, the paper introduced the architecture of the distributed servo control system and the existing problems; After that, the working principles of the twisted-pair CAN bus interface and the optical fiber CAN bus interface were analyzed; Then the servo control system and control strategy based on the optical fiber CAN bus were designed; Finally, a field experiment was carried out, and the experimental results indicated that the scheme had good real-time communication and reliability.
关键词： electromagnetic interference,Servo control system,real-time communication,reliability,optical fiber CAN communication
更新于2025-09-23 15:19:57
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Dynamic Response-Based LEDs Health and Temperature Monitoring
摘要： this paper presents a number of novel methods to measure the junction temperature and to estimate the health of gallium nitride light-emitting diodes (LEDs). The methods are based on measurements of the dynamic impedance and optical output. Our experimental analysis reveals temperature sensitive parameters of the electrical and optical responses. Moreover, a correlation between the non-radiative current characterizing the defects in the active region and the small-signal impedance is demonstrated. The demonstrated methods can be applied to enhance existing techniques. The temperature-monitoring derived dependencies also build a foundation for advanced in-field monitoring health of the LEDs and for prediction of imminent failures using the infrastructure of visible light communication systems. Such models are valuable for predictive maintenance.
关键词： smart driver,failure modes,temperature,impedance,OWC,electrical response,optical response,defects,LED,reliability
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Progress Towards a Non-Lamination Encapsulation Technology to Improve Reliability and Reduce Costs
摘要： New solar module architectures and manufacturing technologies are being developed that significantly reduce manufacturing costs and improve reliability. Variants for both crystalline silicon and thin film devices are being optimized. The outcome of this ongoing program will be a new module designs, streamlined manufacturing processes and accelerated stress results showing improved reliability. Prototype encapsulation process will demonstrate cycle time under 1 minute compared to the current industry method of vacuum lamination which takes more than 10 minutes. The new technology will significantly lower manufacturing costs, process time and reduce capital expenditures by approximately 3-5 times
关键词： encapsulation,lamination,bifacial modules,module reliability
更新于2025-09-23 15:19:57
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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Assessment of the validity of multi-domain LED model parameters in a broad current and temperature range
摘要： In this paper, a power switched, baseband modulation technique for visible light communications (VLC) is proposed and a theoretical model is constructed. It is shown that this technique, called single edge position modulation (SEPM), offers the unique performance characteristic that the communication properties reliability and power and spectral efficiency are invariable over a wide range of dimming levels. It is demonstrated that dimming robustness is obtained by increasing the number of bits per symbol. SEPM is compared with contemporary used baseband power switched modulation techniques for VLC that support dimming. The number of bits per symbol can be chosen to make a compromise between the dimming range over which reliability robustness is obtained on one hand, and the level of power and spectral efficiency on the other hand.
关键词： Modulation,visible light communications,reliability,Monte Carlo simulation,synchronization
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE International Ultrasonics Symposium (IUS) - Glasgow, United Kingdom (2019.10.6-2019.10.9)] 2019 IEEE International Ultrasonics Symposium (IUS) - Tiled Large Element 1.75D Aperture with Dual Array Modules by Adjacent Integration of PIN-PMN-PT Transducers and Custom High Voltage Switching ASICs
摘要： A technique is described, to efficiently evaluate the reliability of an RF semiconductor device when several different mechanisms contribute simultaneously to its wearout. This is of interest for present-day GaN HEMT devices because symptoms of several simultaneous degradation mechanisms have been reported widely. The technique involves first finding DC parameters that are “signatures” of each mechanism. Then, separate DC-stress lifetests are performed to find the degradation rates for the signature parameters, at several temperatures, and the corresponding Arrhenius curves. Next, an RF-stress lifetest (with only one stress condition) is performed, while monitoring all of the signature parameters and the RF performance. This is utilized to determine the “scaling factors” between the rates of change in the DC lifetests and the rates of change in the RF application. Applying these scaling factors to the original Arrhenius curves gives an “overall” Arrhenius plot for the RF application with several different lines, for the different degradation mechanisms. The technique can be extended to further degradation mechanisms, by conducting further DC and RF lifetests while monitoring appropriate signature parameters.
关键词： lifetesting,semiconductor device reliability,gallium nitride,Failure analysis,HEMTs
更新于2025-09-23 15:19:57