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[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Innovative System in Package Design by Laser Ablation Technology
摘要： The 5G revolution brings a lot innovative impact in various applications and business opportunities in mobility, automotive, insdustrial automation and healthcare globally. Therefore, the muti-function integration, form factor miniaturization and time to market of IC package design become the necessary trend in electronic assembly technology. Obviously, system in package (SiP) is the capable solution to meet these requirments and widely applied in the IOT, automotive and sensor module currently. However, the conventional singulation process by blade sawing technology exists the burr residual, inflexible package shape forming and inaccuracy tolerance controlling challenges that brings about low yield and limited package shape design. In this research, the sigulation and metal lid by laser ablation technology in various system in package applications are demonstrated, the metal lid discoloration and burr residual defeat are successfully eliminated by pico second pulses laser technology which shorten the energy absorption time from laser light to electrons and improve the heat-affected zone (HAZ) damage on sawing edge during the ablation process. Therefore, the design of experiment (DOE) shows that the metal lid discoloration rate have been greatly improved from 25% to 0% and without the burr residual issue by utilizing UV laser ablation process. In addition, the package shape forming by UV laser is also studied in this paper, the various geometrical shape that including circle, hexagon and qctagon package appearance are fabricated within 30 um cutting tolerance while without any chipping residual on cutting edge, thus, this formnig technology have been widely applied in various fingerprint sensor and particular module applications in smartphone and automotive industry. The typical reliability testing (Temperature Cycle Test, Hight Temperature Storage Test and unbias HAST) results as a verification. By employing this advanced UV laser ablation technology, the package forming quality and sawing accuracy control can be improved obviously compare to the topically blade sawing process. Undoubtedly, the UV laser ablation with pico pluse technology is absolutely the innovative and powerful weapon to accomplish the high quality SiP design in 5G generation.
关键词： 5G,pico second pulses laser,laser ablation technology,UV laser,package forming,reliability testing,system in package (SiP)
更新于2025-09-23 15:21:01
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AIP Conference Proceedings [AIP Publishing INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - Perak, Malaysia (23–26 April 2019)] INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - FEM simulation of deformations in strings of shingled solar cells subjected to mechanical reliability testing
摘要： Among several emerging interconnection technologies, shingled solar cell interconnection is the technology to realize highest power densities in solar modules. Its main feature is the replacement of ribbon stringing with direct interconnection by a slight overlapping of the solar cells using electrically conductive adhesives (ECA) as joint material. To succeed in a highly competitive market, this type of interconnection still has to prove its reliability, which requires a sound understanding of the loads this ECA joint faces during module lifetime. This study applies structural mechanic simulations based on the Finite Element Method (FEM) to investigate the impact of external loads according to IEC 61215 on a string of shingled solar cells within a solar module laminate. Linear elasticity is compared to the more realistic viscoelastic modelling of the encapsulant (EVA) and the ECA with the objective of reducing computational effort, which is caused by viscoelasticity. We found that linear elasticity can be applied in comparative studies to investigate the potential of different geometric designs to reduce mechanical stress in the joint. When it comes to the calculation of absolute values for stress and strain the strong viscoelastic properties of EVA and ECA cannot be neglected.
关键词： viscoelastic modelling,shingled solar cells,mechanical reliability testing,ECA joint,FEM simulation
更新于2025-09-12 10:27:22
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AIP Conference Proceedings [AIP Publishing 15th International Conference on Concentrator Photovoltaic Systems (CPV-15) - Fes, Morocco (25–27 March 2019)] 15th International Conference on Concentrator Photovoltaic Systems (CPV-15) - Woven multi-ribbon interconnection for back-contact cells: Extending the functionality of the encapsulant
摘要： Back-contact solar cells have shown their potential in the past, with record efficiencies approaching the theoretical maximum value. In parallel, industry-relevant fabrication methods of efficient cells are being developed. Next to this increased power yield, the absence of frontside metallization on the cells greatly improves their aesthetics. The main challenge to manufacture modules using back-contact cells is finding a cost-effective method to electrically interconnect them. In this work, we introduce a novel way of doing so. The interconnection concept is based on a fabric with interwoven metal interconnection ribbons and polymer encapsulant ribbons. It has the advantage of optimized material consumption, low manufacturing cost and low manufacturing temperatures, which lowers the induced thermo-mechanical stress. First proof-of-concept single cell modules have been fabricated and have shown to pass 200 thermal cycles (-40 oC to 85 oC) with no decrease in performance. These reliability tests prove the potential of the concept.
关键词： back-contact solar cells,woven fabric,encapsulant,interconnection,reliability testing
更新于2025-09-11 14:15:04
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Effects of Copper Migration on the Reliability of Through-Silicon Via (TSV)
摘要： Non-destructive electrical characterization was performed to detect copper migration in a degraded through-silicon via structure after various stressing conditions such as elevated temperature exposure, temperature cycling and electrical biasing. They were performed either independently or as a combination with electrical bias for comparison. Variations in the electrical characteristics reflect the presence of copper. The electrical characteristics were also able to monitor the transport of copper ions from an applied electric field. Physical failure analysis was performed to verify the presence of migrated copper, correlating to the changes observed during electrical measurement. With this understanding, reliability assessments become possible where this paper seeks to value add to verify the influence of Cu migration on the conduction mechanism and TDDB lifetime, understanding.
关键词： Electrical characterization,Through-silicon vias,Reliability testing,Dielectric breakdown,Copper
更新于2025-09-10 09:29:36