研究目的
To demonstrate the integration of MEMS-enabled components in a simplified silicon photonics process to enhance functionality and reduce power consumption in photonic integrated circuits.
研究成果
The integration of MEMS-enabled components in a simplified silicon photonics process has been successfully demonstrated, showing potential for enhanced functionality and reduced power consumption in photonic integrated circuits. The custom release process is compatible with standard platforms, paving the way for future large-scale integration.
研究不足
The study focuses on a simplified silicon photonics process, omitting several process modules which may limit the immediate applicability to full-scale production. The release process, while compatible with standard platforms, requires custom post-processing steps.
1：Experimental Design and Method Selection:
The study employs a simplified version of IMEC’s iSiPP50G standard silicon photonics technology platform, omitting several process modules to speed up process development while maintaining full passives functionality. A custom release process was developed at the Center of MicroNanoTechnology (CMi) at EPFL.
2：Sample Selection and Data Sources:
Devices were designed and fabricated on fully processed Silicon Photonics substrates.
3：List of Experimental Equipment and Materials:
Key equipment includes a tunable laser (Agilent 8164A), a detector module, a polarization controller, a fiber array with 127 μm fiber pitch, and electrical probe tips. Materials include silicon-on-insulator (SOI) wafers and alumina for ALD.
4：Experimental Procedures and Operational Workflow:
The release process involves atomic layer deposition of alumina, photolithography, alumina opening by inductively coupled plasma etching, and selective etching of the buried oxide layer by vapor HF etching.
5：Data Analysis Methods:
Optical characterization was performed using a tunable laser and detector module to measure transmission spectra, with data normalized to grating couplers and straight waveguides.
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