研究目的
To develop a novel method for the large-scale, high-throughput, and low-cost fabrication of nanometer-thick carbon films with highly ordered pattern structures for applications in electronics, photonics, energy storage, catalysis, tissue engineering, and sensing.
研究成果
The μCP+DLWc method enables the fabrication of nanometer-thick and regularly patterned CDAs and HCFs with ease-of-fabrication, nanometer-thickness, highly regular and controlled patterns, and the ability to form on both hard and soft substrates. These characteristics make them useful for a broad range of applications in electronics, photonics, energy storage, catalysis, tissue engineering, and sensing.
研究不足
The electrical resistance of the DLWc-created HCF is relatively high, which may limit its use as transparent and electrical conducting material. The mass loss during DLWc is mainly determined by laser conditions, with limited dependence on PAA concentration and PDMS stamp types.
1：Experimental Design and Method Selection
Combination of microcontact printing (μCP) and direct laser writing carbonization (DLWc) to fabricate nanometer-thick and regularly patterned carbon disk arrays (CDAs) and holey carbon films (HCFs).
2：Sample Selection and Data Sources
Pyromellitic dianhydride-oxydianiline-based polyamic acid (PAA) solution used as precursor. PDMS stamps with varied pillar lattice structures for patterning.
3：List of Experimental Equipment and Materials
PDMS stamps, PAA solution, quartz substrates, CO2 laser engraving and cutting system, spin coater, oxygen plasma treatment system, atomic force microscopy (AFM), scanning electron microscope (SEM), transmission electron microscopy (TEM), Raman spectroscopy, X-ray photoelectron spectroscopy (XPS).
4：Experimental Procedures and Operational Workflow
1) Spin-coating of PAA on PDMS stamp, 2) Contact printing of PAA disk onto quartz substrate, 3) Imidization treatment to convert PAA disk into PI disk, 4) DLWc to convert PI disk into carbon disk. For HCFs, additional steps include transfer to PI substrate.
5：Data Analysis Methods
Characterization of CDAs and HCFs using optical microscopy, SEM, TEM, AFM, Raman spectroscopy, and XPS to analyze pattern structure, surface morphology, and chemical structure.
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Transmission electron microscopy
Hitachi HT7700
Hitachi
Used to examine the microstructures of HCFs.
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X-ray photoelectron spectroscopy
Thermo Fisher Scientific ESCALAB 250 XI
Thermo Fisher Scientific
Used to analyze the chemical composition of CDAs and HCFs.
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Atomic force microscopy
Bruker Dimension Icon
Bruker
Used to examine the shape and surface texture of carbon disks and films.
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Scanning electron microscope
Hitachi SU8010
Hitachi
Used to observe and image the pattern structure and surface morphologies of CDAs and HCFs.
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PDMS stamp
Sylgard 184
Used as a stamp for microcontact printing to transfer patterns onto substrates.
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PAA solution
YE1001
Shanghai Wild Wo Industry and Trade Co. Ltd.
Precursor solution for fabricating polyimide disks and films.
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CO2 laser engraving and cutting system
SCE4030
Wuhan Sunic Photoelectricity Equipment Manufacture Co., Ltd.
Used for direct laser writing carbonization (DLWc) to convert polyimide into carbon patterns.
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Spin coater
VTC-200P
Shenyang Branch Crystal Automation Equipment Co. Ltd.
Used for spin-coating PAA solution onto PDMS stamps.
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Oxygen plasma treatment system
ZEPTO
Shanghai Er Di Instrument Technology Co., Ltd.
Used to enhance the hydrophilicity of PDMS stamps for better PAA film spreading.
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Raman microscope
Lab Ram HR800
Used to characterize the carbonaceous structure of CDAs and HCFs.
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