研究目的
Investigating the use of selective laser melting (SLM) to fabricate moulds for the injection moulding of thermoplastic micro?uidic chips, suitable for prototyping and early stage scale-up.
研究成果
The study demonstrated that selective laser melting (SLM) can be used for the fast fabrication of mould tools for injection moulding/hot embossing micro?uidic devices. It is faster, more ?exible, and less expensive than conventional micro-machining processes. However, improvements in accuracy and finish are needed through process optimization and hybrid SLM and machining processes.
研究不足
The accuracy and ?nish of the SLM process still need improvement through process optimization and hybrid SLM and machining processes. The roughness from both the wall and bottom channel caused difficulty in demoulding the micro?uidic part, requiring the use of a mould release agent.
1：Experimental Design and Method Selection:
The study utilized selective laser melting (SLM) to print micro scale metallic patterns on a pre-?nished substrate. The process involved melting fine metal powders locally with a high-energy ?ber laser, allowing the material to solidify as it cooled.
2：Sample Selection and Data Sources:
Stainless-steel CL 20ES powders (316L) were used for printing the micro patterns. A series of generic patterns was designed to test the pattern printing precision and bonding strength with the substrate.
3：List of Experimental Equipment and Materials:
A Mlab cusing laser melting system (Concept laser, Lichtenfels, Germany) was used for SLM. The substrate was pre-machined by die sinking electrical discharge machining (EDM).
4：Experimental Procedures and Operational Workflow:
The laser scanning speed was 600 mm/s with a power of 100 W and a layer thickness of 25 μm. Electropolishing was used to ?nish the tool surface.
5：Data Analysis Methods:
The dimensional accuracy, surface morphology, bonding strength between the printed patterns and substrate, and the microstructure of micro features were characterized.
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