研究目的
Investigating the feasibility of a new glass separation technique for creating interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations.
研究成果
The proposed method could achieve successful separations for various enclosed shapes with the surface roughness and chipping level satisfying the requirement. Essential experimental and numerical parametric studies are performed for optimizing the process window. It is found that the temperature control is crucial for guaranteeing stable crack propagation for glass separation.
研究不足
The success of the proposed scheme relies on both the quality of scribing line and the subsequent crack propagation. The approach has a narrow region on its parameter setup map to produce acceptable results. The size of the enclosed hole and the thickness of glass substrate impose limitations on the approach.
1：Experimental Design and Method Selection:
The study integrates picosecond laser drilling and subsequent thermo-shock crack propagation. Essential analyses are performed based on fracture mechanics and finite element method.
2：Sample Selection and Data Sources:
Chemically strengthened Corning 2320 glass with thickness of 550μm serves as the test specimen.
3：List of Experimental Equipment and Materials:
A TruMicro picosecond laser (wavelength 1030 nm, pulse duration around 10 ps) with an average Bessel beam laser power 50W and an instantaneous maximum power of 250W is used.
4：Experimental Procedures and Operational Workflow:
Micro trenches are drilled by the laser. The perforated structure is heated up to a certain temperature and is then quenched immediately to induce crack propagation.
5：Data Analysis Methods:
The study uses fracture mechanics and finite element coupled temperature-displacement scheme for analysis.
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