研究目的
To study single-event effects (SEEs) in integrated circuits and devices using an ultra-fast pulsed laser system through Two Photon Absorption process and to characterize key factors for a laser-based SEEs mapping testing system.
研究成果
The TPA laser facility provides a reliable method for SEEs testing, with the ability to control the system in an optimal working status. The sensitivity map of the SRAM cell matched well with the simulation results, and the resolution of mapping was achieved around 500 nm. Future work aims to decrease the spot size and modify the spatial resolution of the Beam Scanner Module for more precise measurements.
研究不足
The resolution of laser SEU sensitivity mapping technique is about 0.5 μm, indicating limitations in spatial resolution for deep submicron technology devices.