研究目的
Investigating the activation rate and defects in boron-doped silicon by the self-assembled molecular monolayer (SAMM) doping technique.
研究成果
Boron dopants in SAMM-doped silicon are close to full activation, with carbon-related defects acting as minority carrier traps that have no impact on the activation rate. Only oxygen impurities bind with boron dopants, resulting in the deactivation of less than 1% boron dopants.
研究不足
The study focuses on boron-doped silicon and does not address other dopants or materials. The impact of carbon and oxygen impurities is investigated, but other potential contaminants are not considered.
1:Experimental Design and Method Selection:
The study employs Hall measurements and secondary ion mass spectrometry (SIMS) to investigate boron activation rate, and deep level transient spectroscopy (DLTS) and minority carrier transient spectroscopy (MCTS) to analyze defects in boron-doped silicon by the SAMM technique.
2:Sample Selection and Data Sources:
High-resistivity silicon wafer (>10 kΩ cm) was used for the SAMM-doping process. Control samples were prepared by removing ABAPE in p-xylene solvent.
3:List of Experimental Equipment and Materials:
Schottky diodes were fabricated on SAMM-doped p-type silicon substrate with a resistivity of 10~20 Ω cm. Schottky and Ohmic contacts were fabricated by depositing 200 nm thick Ti on the front surface and 100nm thick Au on the back surface.
4:Experimental Procedures and Operational Workflow:
ABAPE monolayers were covalently bonded onto silicon surface. Van der Pauw four probe measurements were applied in darkness to measure the sheet resistance. DLTS measurements were carried out with temperature scanning from 50 K to 300 K to study the majority carrier traps. MCTS was used to investigate carbon-related defects.
5:Data Analysis Methods:
The hole and boron dopant concentrations were measured by Hall Effect measurement and SIMS, respectively. Defects were analyzed using DLTS and MCTS.
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