研究目的
Investigating the machining of copper micro features with high aspect ratio using ultrashort pulse laser ablation.
研究成果
The machining of flawless micro structures using laser beam ablation is highly dependent on the setup of process parameters. High aspect ratios up to 17 were achieved, but the depth is coupled with width, and vice versa. A trade-off between pulse energy and number of repetitions is necessary to avoid thermal damage. Further research is needed to machine discretionary micro structures such as pillars and cavities.
研究不足
The study is limited by the physical limits of the laser machining process, including the coupling between slot width and depth, and the formation of taper angles. Thermal damage and material debris deposition also pose challenges.
1:Experimental Design and Method Selection:
The study utilized an ultrashort pulse (USP) laser for machining copper surfaces to achieve high aspect ratio microstructures. The process parameters included pulse energy, frequency, scanning velocity, and number of scanning repetitions.
2:Sample Selection and Data Sources:
Pure copper specimens were used for the experiments. The machined slots were analyzed using scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX).
3:List of Experimental Equipment and Materials:
A DUETTO ultrashort pulse laser machine from TIME-BANDWIDTH PRODUCTS was used, along with an ALICONA INFINITEFOCUS Microscope for visualization.
4:Experimental Procedures and Operational Workflow:
Slots with varying width and depth were machined to maximize the aspect ratio while minimizing thermal damage. The taper angle and material debris were analyzed.
5:Data Analysis Methods:
A MATLAB image recognition script was programmed to investigate quality attributes such as width, depth, material removal rate, and taper angle.
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