研究目的
To achieve a better thermal performance of the high-power laser diode arrays by designing and fabricating a hybrid microchannel and slot jet array heat sink.
研究成果
The hybrid microchannel and slot jet array heat sink demonstrates superior cooling performance for high-power laser diode arrays, with a significant reduction in thermal resistance compared to existing solutions. The design is promising for applications requiring efficient heat dissipation in electronic chips.
研究不足
The study focuses on the cooling performance of a specific hybrid heat sink design for high-power laser diode arrays. The influence of slot jet length on thermal resistance and pressure drop is analyzed, but other geometric parameters and their effects are not explored. The comparison with other cooling solutions is limited to published data, and some numerical results need further experimental validation.
1：Experimental Design and Method Selection:
The study involves designing a hybrid microchannel and slot jet array heat sink for cooling high-power laser diode arrays. The forward voltage method is used to measure the chip temperature, and the structure function method is applied to obtain the thermal resistance of the heat sink.
2：Sample Selection and Data Sources:
A standard commercial laser bar with a wavelength of 808 nm is packaged on the heat sink. Deionized water is used as the coolant.
3：List of Experimental Equipment and Materials:
The experimental setup includes a gear pump for coolant input, resistance thermometers for temperature monitoring, pressure sensors for pressure measurement, a turbine flowmeter for flow rate measurement, an optical power sensor for measuring the optical power of the HPLDA, and a high-frequency data acquisition module for collecting voltage variations.
4：Experimental Procedures and Operational Workflow:
The experiments assess the cooling performance of the hybrid heat sink under different flow rates. The chip temperature is measured via the forward voltage method, and the thermal resistance is calculated based on the structure function method.
5：Data Analysis Methods:
The thermal resistance is evaluated using the structure function method, and the pressure drop is calculated by the difference between inlet and outlet pressures. The optical power and temperature rise of the chip are discussed for different operating currents and flow rates.
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