研究目的
Optimisation of the SSAIL method for laser-assisted selective electroless copper deposition on dielectrics by evaluating properties of the final metal-plated traces.
研究成果
The SSAIL method was successfully optimised for selective electroless copper deposition on various polymers. Optimal laser processing parameters were identified to achieve sufficient electrical conductivity, spatial selectivity, and adhesion strength of the plated copper layer.
研究不足
The study is limited to the evaluation and optimisation of the SSAIL process on specific polymers. The spatial selectivity and reliability of plating are influenced by laser processing parameters and material properties.
1：Experimental Design and Method Selection:
The SSAIL method includes laser modification of the polymer surface, chemical activation of the modified areas, and electroless plating.
2：Sample Selection and Data Sources:
Various polymers were used as substrates.
3：List of Experimental Equipment and Materials:
Picosecond solid-state laser, galvanometric scanner, chemical solutions for activation and plating.
4：Experimental Procedures and Operational Workflow:
Laser processing parameters were varied, followed by chemical activation and electroless plating.
5：Data Analysis Methods:
Sheet resistance measurements, adhesion tests, and spatial selectivity evaluation were performed.
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