研究目的
To verify the fluidic operation of a partially shielded digital microfluidics device and develop a numerical model to predict the impact of the partially shielding electrode on threshold voltage, EW force, fluid velocity, and droplet transport time.
研究成果
The integrated EP/EWD device was found to support droplet transport at an elevated EW threshold voltage without exhibiting signs of catastrophic device failure. Theoretical predictions and experimental observations showed agreement within reasonable operating margins. The study supports the development of design rules for microfluidic devices that require partially shielding metal layers.
研究不足
The study acknowledges the challenges in modeling the effects of surfactants and cells in the fluid, as well as the need for a more rigorous model that accounts for the electric field distribution in the EWD dielectric and droplet interface dynamics.
1:Experimental Design and Method Selection:
The study utilized theoretical and experimental approaches to model and verify the operation of a partially shielded digital microfluidics device. A numerical model was developed to predict the impact of the partially shielding electrode on various fluid transport parameters.
2:Sample Selection and Data Sources:
The study involved the fabrication and testing of devices with and without an additional metal layer to compare their performance.
3:List of Experimental Equipment and Materials:
Devices were fabricated using standard microfabrication techniques, including the use of SU-8 for the EW dielectric film and CYTOP for the hydrophobic layer.
4:Experimental Procedures and Operational Workflow:
Droplet transport parameters were measured for devices with and without the additional metal layer, including threshold voltage, transport time, and actuation velocity.
5:Data Analysis Methods:
The experimental results were compared with the predictions from the numerical model to assess the impact of the partially shielding electrode.
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CO2 laser cutting system
VLS 6.60
Universal Laser Systems
Used for cutting the polyester film for gaskets.
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SU-8 2002
MicroChem, Inc.
Used as the EW dielectric film in the fabrication of the EP/EWD devices.
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CYTOP
20% wt.
Bellex International Corp.
Used as an amorphous fluoropolymer hydrophobic layer on the chips.
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MA6 Frontside/Backside Mask Aligner
Süss MicroTec
Used for patterning the SU-8 with a bright field mask.
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NFR 016 D2
JSR Micro, Inc.
Negative photoresist used in the fabrication process.
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MF-319 Shipley Microposit? developer
Shipley
Used for developing the negative photoresist.
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Duralar polyester
0.005” (127 μm)
Gra?x Plastics, Inc.
Used for fabricating EWD gaskets.
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CNC end mill stage
Roland Modela: MDX-20
Roland
Used for machining the EP/EWD top plates.
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PVD 75 RF dielectric sputter system
Kurt J. Lesker Co.
Used for depositing ITO onto the plastic substrates.
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