研究目的
To present a novel waveguide packaging for sub-millimeter and terahertz-wave devices suitable for large chip-width MMICs without requiring any additional fabrication process.
研究成果
The WR3.4 WG packaging technique with on-chip E-plane probes provides large freedom in design area with no etching process in MMIC fabrication. Despite potential parasitic modes induced by E-plane slits, these can be effectively absorbed with lossy and high-permittivity material, achieving 1 dB coupling loss per probe and 60 dB isolation in the 260–320 GHz band.
研究不足
The study is limited to the 260–320 GHz band and specific configurations of waveguide packaging. The approach may require further optimization for other frequency bands or MMIC designs.
1：Experimental Design and Method Selection:
The study involved full electromagnetic simulation to analyze wave modes in a rectangular waveguide with thin E-plane slits for inserting large-width MMICs.
2：Sample Selection and Data Sources:
A
3：1-mm-wide test IC was used in the 260–320 GHz band. List of Experimental Equipment and Materials:
The setup included a WR
4：4 WG package with single slit and p-type Si block as absorber. Experimental Procedures and Operational Workflow:
The methodology included fabricating a test IC with dipole antennas for in/output coupling, dense substrate vias, and CPW lines on a 50-μm-thick InP substrate.
5：Data Analysis Methods:
S-parameter measurements were conducted to evaluate the performance.
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