研究目的
Investigating the ablation behavior of SiCp/AA2024 composites irradiated by a single-pulse nanosecond laser to understand the interaction patterns between the composite matrix and the reinforcing phase under laser action.
研究成果
The study concluded that the HAZ area of the material irradiated by the single-pulse laser increased with the pulse energy density in a logarithmic pattern. The SiC particles in the composite heated more rapidly under the nanosecond laser, and the heat was transferred to the matrix. Large SiC particles constrained the matrix’s molten pool, accelerating its gasification but hindering further etching. The etching depths of the Al alloy matrix and SiC particles in the composites were smaller than those in the homogenous materials.
研究不足
The study focused on the effect of a single pulse on the composites, which is a basic study for laser processing. The practical industrial applications involve continual pulse irradiation, which may have different effects.
1:Experimental Design and Method Selection:
The study used a single-pulse nanosecond fiber laser to irradiate homogenous Al alloy and SiC materials and SiCp/AA2024 composites. The laser had a 200 ns pulse width and 1064 nm wavelength.
2:Sample Selection and Data Sources:
Two types of SiCp/AA2024 composites with mean particle diameters of 5 μm and 30 μm were used. The volume fractions of the SiC particles were fixed at 45%.
3:5%. List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: An optical laser (YLPM-1-A4-20-20, IPG Photonics Corporation), SEM (S-3400N, Hitachi, Japan), EDS (Bruker Quantax), and a laser-scanning confocal microscope were used.
4:Experimental Procedures and Operational Workflow:
The materials were irradiated by the laser pulse, and the surface microstructure was observed via SEM. The elementary compositions were analyzed by EDS. The HAZ and material surface depth were measured.
5:Data Analysis Methods:
The variations in the HAZ area with the pulse energy density were plotted and analyzed. The etching depths of the materials were measured and compared.
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