研究目的
To perform thermal design for the package of high-power single-emitter laser diodes using an analytical three-dimensional thermal model, focusing on optimizing heat sink and submount designs under various convective heat transfer conditions.
研究成果
The study concludes that thermal design for high-power single-emitter laser diodes is highly dependent on external cooling conditions. The current heat sink design for commercial F-Mount laser diodes leads to a significant increase in thermal resistance, with the key limitation in the heat sink length direction. Optimal designs vary with cooling conditions, stripe widths, cavity lengths, and materials used.
研究不足
The study assumes temperature-independent thermal and mechanical parameters for all materials, which may not account for variations under extreme conditions. The model also assumes adiabatic conditions on top and side walls of the package, which might not fully represent real-world scenarios.
