研究目的
Modeling of technology aspects for fabrication ceramic MEMS microhotplate and SMD packaging for MOX gas sensors applications.
研究成果
The research demonstrates the feasibility of rapidly fabricating ceramic MEMS microhotplates in SOT-23 type SMD packages using laser micromilling technology. It highlights the potential for reducing power consumption by optimizing the microhotplate configuration and suggests transitioning to vacuum sputtering for metallization to achieve further reductions.
研究不足
The study identifies the need to reduce the thickness of Pt metallization to decrease power consumption, suggesting a shift from thick film technology to vacuum sputtering for future improvements.
1：Experimental Design and Method Selection:
The study employs laser micromilling technology for ceramic MEMS fabrication, focusing on the fabrication of MEMS microhotplates and SMD packages.
2：Sample Selection and Data Sources:
The research uses monolithic zirconium oxide material and Al2O3 MEMS structures after laser micromilling.
3：List of Experimental Equipment and Materials:
Includes laser micromilling technology, composite Pt paste for metallization, and COMSOL for modeling.
4：Experimental Procedures and Operational Workflow:
Describes the fabrication process of MEMS microhotplates and SMD packages, including the deposition of Pt paste and assembly.
5：Data Analysis Methods:
Utilizes COMSOL for modeling power consumption and temperature distribution, and SEM for geometric parameters analysis.
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