研究目的
To present recent advancements in micro-crack inspection of crystalline silicon wafers and solar cells, highlighting new challenges and breakthrough inventions in response to recent developments in the photovoltaic industry.
研究成果
The study concludes that the TF method offers a superior and more practical technique for micro-crack detection in silicon wafers and solar cells, achieving better performance in terms of sensitivity and specificity compared to existing technologies. It opens up opportunities for future development, including the visualization of minute micro-cracks and the estimation of solar cell lifetimes.
研究不足
The study acknowledges the difficulty in distinguishing micro-cracks from other inherent artefacts in the cell or wafer, which requires sophisticated image processing algorithms. The success of current methods is limited, with high over rejection rates and false positives.
1：Experimental Design and Method Selection:
The study reviews existing methods for micro-crack detection, including optical transmission (OT), electroluminescence (EL), and photoluminescence (PL), and introduces new techniques like vicinal illumination and transflection (TF).
2：Sample Selection and Data Sources:
The study uses 240 samples divided into defective and intact groups, including monocrystalline and polycrystalline silicon wafers and solar cells.
3：List of Experimental Equipment and Materials:
The study mentions the use of collimated light sources in the NIR spectrum, cameras, and laser sources for TF imaging.
4：Experimental Procedures and Operational Workflow:
The study describes the process of inducing micro-cracks artificially and comparing the effectiveness of OT, EL, PL, and TF methods in detecting these cracks.
5：Data Analysis Methods:
The study uses sensitivity, specificity, and accuracy as quantitative measures to compare the classification results of different imaging techniques.
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