研究目的
Investigating the thermal loading and lifetime estimation for power devices considering mission profiles in wind power converters to improve reliability and reduce costs.
研究成果
A comprehensive lifetime estimation method for power semiconductors in wind power converters is proposed, separating analysis under different time constants of thermal behaviors. This method provides detailed lifetime information, useful for indicating and improving system reliability weaknesses. The estimated thermal behaviors are validated on a downscale experimental setup.
研究不足
The existing lifetime estimation methods are not yet suitable for wind power applications due to not well-specified and included comprehensive mission profiles. The proposed approach aims to address this gap but may still have limitations in fully capturing all aspects of thermal behaviors under varying conditions.