研究目的
Investigating the one-step method for cutting quartz plates using ultrashort laser pulses to achieve neat and flat cut edges without external tensile stress.
研究成果
The study demonstrated that single-pass stealth dicing of quartz plates is achievable with ultrashort laser pulses. Optimal cutting quality was obtained at a repetition rate of 50 kHz, with controlled pulse energy and overlap. The process is attributed to the accumulation of tensile stresses leading to micro-fractures that propagate along the laser path.
研究不足
The study was limited to quartz plates of 250 μm thickness. The quality of cuts was found to degrade at higher repetition rates and pulse energies due to excessive thermal load and stress accumulation.
1：Experimental Design and Method Selection
The study utilized a femtosecond laser system to perform stealth dicing on quartz plates. The laser parameters such as repetition rate, pulse energy, and scan speed were varied to investigate their effects on the cutting process and quality.
2：Sample Selection and Data Sources
250-μm-thick Z-cut quartz plates were used as samples. The cutting quality was evaluated through optical microscopy and optical profilometry.
3：List of Experimental Equipment and Materials
The laser source was the Pharos SP 1.5 from Light Conversion, providing 200 fs pulses. The setup included a microscope objective with a focal length of 8 mm and motorized stages for precise sample movement.
4：Experimental Procedures and Operational Workflow
The laser beam was focused inside the quartz plates, and the samples were moved perpendicular to the beam axis. The influence of laser parameters on the cutting process was systematically investigated.
5：Data Analysis Methods
The quality of the cut edges was analyzed using optical microscopy and profilometry to assess roughness and flatness.
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