研究目的
The integration of lasers operating in the visible range within a microfluidic platform for enabling in situ optical measurements in lab-on-a-chip applications, overcoming the silicon absorption limit below 1.1 μm.
研究成果
The work successfully demonstrates silicon cavities with ultra-wide band operation from the visible to the IR spectrum, enabling visible lasing on silicon at 562.4 nm. This platform integrates hollow core optofluidic channels with optical cavities, suitable for lab-on-chip applications.
研究不足
The study is limited by the spectral resolution of the spectrometer used, which affects the precise measurement of quality factors at shorter wavelengths. Additionally, the fabrication process introduces small defects at the bottom of the micromirrors due to lateral etching.
1:Experimental Design and Method Selection:
The study employs deep reactive ion etching (DRIE) of silicon to fabricate microcavities with hollow-core planar waveguides (HCPWs) for ultra-wide band operation.
2:Sample Selection and Data Sources:
Silicon substrates are used to fabricate the microcavities, with Rhodamine 6G (R6G) as the active medium for lasing demonstration.
3:List of Experimental Equipment and Materials:
Includes DRIE for silicon etching, sputtering for metallization, and optical fibers for light coupling.
4:Experimental Procedures and Operational Workflow:
Fabrication involves DRIE of silicon, metallization, and integration of microfluidic channels filled with R6G. Optical characterization is performed using fiber-based sources and spectrometers.
5:6G. Optical characterization is performed using fiber-based sources and spectrometers. Data Analysis Methods:
5. Data Analysis Methods: Transmission spectra and quality factors are analyzed to evaluate cavity performance.
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