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Tiled Monolayer Films of 2D Molybdenum Disulphide Nanoflakes Assembled at Liquid/Liquid Interfaces

DOI:10.1021/acsami.0c03794 期刊:ACS Applied Materials & Interfaces 出版年份:2020 更新时间:2025-09-23 15:21:01
摘要: Thin films of MoS2 bilayer nanoflakes, which are predominantly a single flake thick and in edge-to-edge contact, have been produced via self-assembled tiling at the planar interface between two immiscible liquids. Films of several square centimeters extent can be produced with total covered area approaching 90 % and over 70 % of the film covered by single flakes without overlap. Films produced through liquid/liquid assembly are shown to produce a lower uncovered area fraction and more uniform thickness when compared with films of similar areal coverage produced by the “top-down” techniques of spin coating and spray coating. Statistical analysis of flake coverage data, measured by AFM, shows that liquid/liquid assembly produces a distinctly different variation in film thickness than conventional “top-down” deposition. This supports the hypothesis that the 2D confinement of liquid/liquid assembly produces more uniform films. Demonstrator field-effect transistors (FETs) manufactured from the films exhibit mobility and on/off current ratios of 0.73 cm2 V-1 s-1 and 105 respectively; comparable to FETs of similar layout and CVD-grown or mechanically cleaved single crystal MoS2 channel material. This work demonstrates the use of liquid/liquid interfaces as a useful tool for self-assembly of high performance thin film devices made from dispersions of 2D materials.
作者: Joseph Neilson,Michael Avery,Brian Derby
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Investigating the assembly of 2D molybdenum disulphide nanoflakes at liquid/liquid interfaces for the fabrication of high performance thin film devices.

The liquid/liquid assembly method produces MoS2 films with superior uniformity and coverage compared to traditional top-down methods, leading to high-performance FETs with mobility and on/off ratios comparable to those made from CVD-grown or mechanically cleaved MoS2. This method offers a promising route for the scalable fabrication of 2D material-based electronic devices.

The study is limited by the potential for flake overlap during the assembly process and the need for further optimization of device performance through methods such as dielectric coating and surface treatment.

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