1：Experimental Design and Method Selection:

Ultra-precision diamond turning tests with chamfered diamond tools were conducted to investigate the influence of chamfer angle and process conditions on the surface integrity of single crystal silicon. State-of-the-art techniques were used for surface characterization and subsurface damage detection.

2：Sample Selection and Data Sources:

Polished silicon work material with (100) crystal plane and 50 mm diameter with 3 mm thickness was used. Different polished silicon samples were used for each chamfer angle in experiments.

3：List of Experimental Equipment and Materials:

An ultra-precision diamond turning machine Moore Nanotechnology 350 FG, chamfered single crystal diamond tools with 20°, 30°, and 45° chamfer angles, confocal laser microscope Keyence VKX110, white-light interferometer (NewView-7200, Zygo Corporation), and a laser micro-Raman spectrometer (WITec alpha series).

4：Experimental Procedures and Operational Workflow:

Machining experiments were conducted under heavy use of coolant. Different phases of experiments were conducted with varying depth of cut and feed conditions to mimic varying contact conditions typical during machining of freeform surfaces.

5：Data Analysis Methods:

Surface topographies were investigated using confocal laser topography and scanning white light interferometer. Measurement data were processed on Mountains Map software 7.4 based on ISO 25178 standard. Laser micro Raman tests were performed for all machining experiments.