研究目的
Investigating the prognostication methods for assessing accrued damage and impending failure in automotive electronics under high temperature and vibration conditions.
研究成果
The study developed a new method for prognostication of electronics subjected to combined high-temperature and vibration, using strain signal analysis. The method identified feature vectors that can predict impending failure, with PCA and EMD providing insights into damage progression. The variance of principal components of instantaneous frequency showed potential as a health-monitoring feature.
研究不足
The study focuses on leadfree electronic assemblies under specific conditions of high temperature and vibration. The applicability of the findings to other materials or conditions may require further investigation.
1:Experimental Design and Method Selection:
The study involved subjecting leadfree electronic assemblies to high temperature vibration at 5g and 155°C. Spectrogram and Principal Component Analysis (PCA) were used to analyze the data.
2:Sample Selection and Data Sources:
Daisy-chained parts on test boards were used, with strain signals acquired at specific intervals during vibration.
3:List of Experimental Equipment and Materials:
Electro dynamic shaker with heating chamber, strain gauges, digital storage oscilloscopes, and strain-gage amplifier.
4:Experimental Procedures and Operational Workflow:
The boards were vibrated at their first natural frequency, with strain signals acquired at a sampling frequency of 10,000 Hz. Data was analyzed using FFT, EMD, and PCA.
5:Data Analysis Methods:
The frequency content of the strain signals was analyzed using FFT, and EMD was used to decompose the signals into IMFs. PCA was applied to reduce dimensionality and identify patterns.
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