研究目的
Investigating the ductile response of B270 type glass during single point diamond turning under sub-micrometer cutting conditions.
研究成果
The brittle-to-ductile transition for B270 glass occurs at depths of 131-209 nanometers, similar to semiconductor crystal machining with diamond tools. The material removal mechanism is totally ductile at cutting depths lower than 0.100 micrometer/revolution. The study suggests that more negative rake angle tools could present better results in terms of critical depth of cut.
研究不足
The depth range for ductile behavior is very low, indicating uneconomical cutting conditions in terms of material removal rate. The rake angle of the tool may not be sufficiently negative to hinder the mechanism of brittle failure.
1：Experimental Design and Method Selection:
Single point diamond turning tests were conducted on B270 type glass under sub-micrometer cutting conditions to study the brittle-to-ductile transition.
2：Sample Selection and Data Sources:
B270 glass samples were used, fixed on a mounting plate at the center of the spindle.
3：List of Experimental Equipment and Materials:
Ultraprecision machine tool (ASG 2500), single point diamond tool (CO45NG** nose radius
4：13665 mm, rake angle –5° and clearance angle 12°), atomic force microscope (Digital Nanoscope IIIa), optical microscope, and scanning electron microscope (Zeiss model DSM 960). Experimental Procedures and Operational Workflow:
The workpiece surface was slightly tilted to the spindle axis for varying cutting depths. Alkalisol 900 was used as lubricant and coolant. The spindle speed was kept constant at 100 RPM.
5：Data Analysis Methods:
Surface and profile analysis by atomic force microscopy, observation of chips and surface by optical and scanning electron microscopy.
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