研究目的
To develop a cost-effective wet chemistry solution for preparing CTE-controlled interconnects based on nanocarbon-reinforced copper matrix composite for power electronics packaging.
研究成果
The electrodeposition process serves as a sieving and fine-tuning tool to control GnP co-deposition, facilitating microstructure and property optimization of the composite coatings. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance compared to untreated Cu and pure Cu deposited counterparts, but the increase is tolerable for practical applications.
研究不足
The study focuses on the electrodeposition process and initial characterization of Cu-GnP composites. Further research is needed to fully understand the in-depth distribution of GnPs within the coatings and their long-term performance in power electronics packaging.
1：Experimental Design and Method Selection:
A single-step electrodeposition route was used for fabricating Cu-GnP nanocomposite coatings. The effect of cathodic current density on the surface morphology was examined.
2：Sample Selection and Data Sources:
Pure polycrystalline copper substrates were used as the cathode. Graphene nanoplatelets (GnPs) were co-deposited with copper.
3：List of Experimental Equipment and Materials:
A two-electrode glass cell configuration was adopted. Equipment included a QPX 1200S DC power source, Carl Zeiss Leo 1530 FEGSEM system, Thermo Scientific K-α X-ray Photoelectron Spectrometer, and Keithley 2440 5A Source meter.
4：Experimental Procedures and Operational Workflow:
Electrodeposition was conducted at 20oC with magnetically stirred agitation at 300 r.p.m.. Current densities were applied with equivalent electric charge passed at 12 C/cm
5：Data Analysis Methods:
Surface morphology was examined using FEGSEM and EDX. XPS was used for compositional depth profiling. Electrical resistance was assessed by a four-point probe method.
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