研究目的
Investigating the equivalent thermal properties of the BEOL composite for application in self-heating simulations.
研究成果
Utilizing dedicated test-structures, we studied the equivalent thermal properties of the BEOL composite. We found that the via configuration can impact the lateral heat diffusion, and this by 35%. It was confirmed by 3DFEM simulations that the dense metal stack can be replaced by a simplified alternative with anisotropic properties. The anisotropic thermal properties provided in this paper can serve as calibrated parameters for FET thermal simulations.
研究不足
The proposed approach is only valid when the BEOL is not directly contacting the heat source and at least one layer is completely separated from the heat source by ILD.
1：Experimental Design and Method Selection:
Dedicated test-structures were designed in a commercially-available 28nm CMOS technology utilizing Cu interconnects. Both diode and metal lines can act as heating or sensing elements.
2：Sample Selection and Data Sources:
Diodes are embedded in the substrate and a small thermal sensor is placed in metal 5 (M5).
3：5). List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Keithley 2602’s on a wafer prober equipped with a thermochuck.
4：Experimental Procedures and Operational Workflow:
The temperature increase in the metal resistors as a function of heat dissipation in the diodes are measured and vice versa.
5：Data Analysis Methods:
3DFEM simulations to simulate the properties of the unit cells as a function of the ILD thermal conductivity (κ), and to simulate the entire DoE utilizing the thermal properties.
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