1：Experimental Design and Method Selection:

The study involved electrodeposition of Au-Ag films on Si wafers with sputtered Au or Pt seed layers, followed by annealing and dealloying processes. The relationship between electrolyte composition, morphology, and dealloying mechanism was investigated.

2：Sample Selection and Data Sources:

Samples were prepared with varying bath compositions and annealing temperatures. Composition and morphology were analyzed using ICP-MS, GDOES, and FE-SEM.

3：List of Experimental Equipment and Materials:

Equipment included an electrochemical analyzer (HZ-7000, Hokuto Denko), FE-SEM (FESEM S4800, Hitachi High-Technologies), ICP-MS (Thermo Fisher Scientific), and GDOES (JY-5000RF, HORIBA). Materials included HAuCl4·4H2O, AgNO3, thiourea, and H2SO

4：Experimental Procedures and Operational Workflow:

Au-Ag films were electroplated at -0.7 V vs. Ag/AgCl for 0.5 h, annealed at temperatures from 50 to 150 °C, and dealloyed in 0.1 M HNO3 solution. Anodic evaluation was performed to study dissolution properties.

5：7 V vs. Ag/AgCl for 5 h, annealed at temperatures from 50 to 150 °C, and dealloyed in 1 M HNO3 solution. Anodic evaluation was performed to study dissolution properties. Data Analysis Methods:

5. Data Analysis Methods: Composition and depth profile were analyzed using ICP-MS and GDOES. Morphology was characterized by FE-SEM. Dissolution properties were evaluated through anodic polarization measurements.