摘要： The authors present a low-temperature process for the homoepitaxial growth of antimony superlattices in silicon. The all low-temperature superlattice doping process is compatible as a postfabrication step for device passivation. The authors have used low-temperature molecular beam epitaxy to embed atomically thin (2D), highly concentrated layers of dopant atoms within nanometers of the surface. This process allows for dopant densities on the order of 1013–1014 cm?2 (1020–1021 cm?3); higher than can be achieved with three-dimensional doping techniques. This effort builds on prior work with n-type delta doping; the authors have optimized the growth processes to achieve delta layers with sharp dopant profiles. By transitioning from a standard effusion cell to a valved cracker cell for antimony evaporation, the authors have achieved carrier densities approaching 1021 cm?3 with peak distribution at ～10 ? FWHM for single delta layers. Even at the highest dopant concentrations studied, no deterioration in carrier mobility is observed, suggesting the upper limit for dopant incorporation and activation has not yet been met. The authors will discuss the details related to growth optimization and show results from in situ monitoring by electron diffraction. They will also report on elemental and electrical characterization of the films.