研究目的
To propose a new method based on optical sectioning microscopy for characterizing multilayer structures with micro-scale air gaps, demonstrating its potential applications in fields like semiconductor and biochip.
研究成果
The proposed technique based on OSM with structured illumination and FDA for noise suppression successfully achieves 3D surface topography and gap thickness distribution of multilayer structures with micro-scale air gaps, demonstrating potential applications in semiconductor and biochip fields.
研究不足
1. The technique is not suitable for thickness under 1μm due to resolution limits. 2. Materials on the substrate must be transparent or translucent. 3. Larger filter windows in FDA can eliminate noise but may lose high frequency information.
1:Experimental Design and Method Selection:
Utilizes optical sectioning microscopy with structured illumination to measure multilayer structures with micro-scale air gaps.
2:Sample Selection and Data Sources:
Uses a multilayer structure with air gap provided by the BGI company.
3:List of Experimental Equipment and Materials:
Includes a CCD camera, broadband light source, microscopy, and piezo-electric transducer scanning stage.
4:Experimental Procedures and Operational Workflow:
Involves scanning the sample in the Z-direction, capturing patterns, and applying phase-shifting algorithm and frequency-domain analysis for noise suppression.
5:Data Analysis Methods:
Uses Gaussian fitting to extract peak positions from the contrast response curve for surface topography and gap thickness distribution.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容