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Implementing Inkjet-Printed Transparent Conductive Electrodes in Solution-Processed Organic Electronics

DOI:10.1002/admt.201800474 期刊:Advanced Materials Technologies 出版年份:2019 更新时间:2025-09-23 15:23:52
摘要: Through the use of solution-based materials, the field of printed organic electronics has not only made new devices accessible, but also allows the process of manufacture to move toward a high throughput industrial scale. However, while solution-based active layer materials in these systems have been studied quite intensely, the printed electrodes and specifically the transparent conductive anode have only relatively recently been investigated. In this progress report, the use of metal nanoparticles within printed organic electronic devices is highlighted, specifically their use as replacement of the commonly used indium tin oxide transparent conductive electrode within organic photovoltaics (OPVs) and organic light emitting diodes (OLEDs). A cross fertilization between the applications is expected since an OPV device is essentially an inversely operated OLED. This report aims to highlight the use of inkjet-printed nanoparticles as cost-effective electrodes for printed optoelectronic applications and discusses methods to improve the conductive and interfacial properties. Finally, in an outlook, the use of these types of metal nanoparticle inks to manipulate light management properties, such as outcoupling, in the device is investigated.
作者: Felix Hermerschmidt,Stelios A. Choulis,Emil J. W. List-Kratochvil
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To highlight the use of inkjet-printed nanoparticles as cost-effective electrodes for printed optoelectronic applications, specifically replacing indium tin oxide in organic photovoltaics and organic light emitting diodes, and to discuss methods to improve conductive and interfacial properties.

The report concludes that inkjet-printed metal nanoparticle electrodes are viable alternatives to ITO, with embedded grids showing superior performance in OLEDs due to reduced leakage currents and improved light outcoupling. Copper inks offer cost benefits but face oxidation challenges, which can be mitigated with proper sintering. Future work should focus on optimizing light management and expanding to flexible and wearable applications.

The paper is a progress report and does not present new experimental data; it reviews existing work. Limitations include the brittleness and cost of ITO, oxidation issues with copper inks, challenges in achieving low leakage currents and high efficiencies comparable to ITO, and the need for optimized sintering processes and grid designs.

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