研究目的
Investigating the microstructural evolution and thermal stability of nitride-based metal/semiconductor superlattices for thermoelectric and hard-coating applications.
研究成果
The research demonstrates that (Hf,Zr)N/ScN superlattices exhibit superior thermal stability compared to TiN-based systems, with minimal interdiffusion after annealing. This enhances their applicability in thermoelectric and hard-coating technologies. Future studies should focus on scaling up production and testing under operational conditions.
研究不足
The study is limited to specific nitride-based superlattice systems and annealing conditions; generalizability to other materials or temperatures may require further investigation. Optimization could involve varying annealing parameters or exploring additional characterization techniques.
1:Experimental Design and Method Selection:
The study employs high-resolution (scanning)/transmission electron microscopy (HR(S)/TEM) imaging and energy dispersive x-ray spectroscopy (EDX) mapping to analyze the microstructure and thermal stability of superlattices. Samples are as-deposited and annealed to observe changes.
2:Sample Selection and Data Sources:
Epitaxial metal/semiconductor superlattices, including TiN/(Al,Sc)N, (Ti,W)N/(Al,Sc)N, and (Hf,Zr)N/ScN, grown by magnetron sputtering on [001]MgO substrates.
3:List of Experimental Equipment and Materials:
FEI Titan3 60-300 microscope with Gatan Quantum ERS GIF, high-brightness XFEG source, and Super-X EDX detector, operated at 300 kV.
4:Experimental Procedures and Operational Workflow:
Samples are prepared, imaged using STEM and HRTEM, and subjected to EDX mapping before and after annealing at 950 °C for 120 hours to assess diffusion and stability.
5:Data Analysis Methods:
Analysis involves interpreting TEM images and EDX maps to evaluate defect density, phase purity, interface roughness, and stoichiometry.
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