研究目的
To develop low-dielectric-constant aromatic homopolyimide and copolyimide materials for use in microelectronics to reduce signal delay by decreasing the dielectric constant of insulating materials.
研究成果
The synthesized homopolyimides and copolyimides exhibited lower dielectric constants (2.34-2.90 at 1 MHz) compared to the reference polyimide (3.10), along with good thermal and mechanical properties. Factors such as interchain distance, quantity of phenyl ether bonds, and substituent position were identified as key in enhancing molecular flexibility, increasing free volume, and reducing polarization points, thereby lowering the dielectric constant. This provides a promising approach for developing advanced dielectric materials in microelectronics.
研究不足
The study is limited to specific monomers and synthesis conditions; scalability and industrial application may require further optimization. The dielectric constant reduction, while significant, may not meet all future microelectronics demands, and compatibility issues in copolymers could affect performance.
1：Experimental Design and Method Selection:
The study involved synthesizing homopolyimides and copolyimides using pyromellitic dianhydride (PMDA) as the anhydride monomer and various amine monomers (ODA, 2,2-bis[4-(4-aminephenoxy)phenyl]propane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene) through a two-step process: formation of poly(amide acid) precursor in DMF solvent under nitrogen atmosphere, followed by thermal imidization. The rationale was to modify molecular structure to increase free volume and reduce dielectric constant.
2：Sample Selection and Data Sources:
Samples included seven polyimides (1-7) with specific repetitive structural units, prepared in laboratory settings. Selection criteria were based on the type and combination of monomers to study effects on properties.
3：List of Experimental Equipment and Materials:
Equipment included three-necked round-bottom flasks, ovens, vacuum systems, FTIR spectrometer (Brook Instruments Co.), TGA analyzer (Netzsch Instrument Trade Co., Ltd.), thermomechanical analyzer (Netzsch Instrument Trade Co.), dielectric constant device (Concept 50 Broadband Dielectric Spectroscopy from Novocontrol Technologies GmbH & Co. KG), universal mechanical test machine (AGS-10KNI, Shimadzu Corp.). Materials included PMDA, ODA, DMF, CaH2, and amine monomers from various suppliers.
4：Experimental Procedures and Operational Workflow:
For each polyimide, monomers were dissolved in DMF, stirred under nitrogen, PMDA added incrementally, stirred for 24h in ice bath to form poly(amide acid), cast onto glass substrate, heated at 80°C for 2h, then in vacuo at 100°C, 200°C, and 300°C for 1h each with 1°C/min heating rate to produce thin films (10-50 mm thickness). Characterization involved FTIR, TGA, thermomechanical analysis, dielectric measurements, and tensile testing as per standard methods.
5：Data Analysis Methods:
FTIR spectra analyzed for functional groups; TGA and thermomechanical analysis provided thermal properties; dielectric measurements gave dielectric constant and loss; tensile testing measured mechanical properties. Data interpreted to correlate molecular structure with properties.
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