研究目的
To study the effect of crystal orientation on the crack propagation of A-plane, C-plane, M-plane and R-plane sapphire under impact load and static load, respectively.
研究成果
Sapphire exhibits anisotropic crack propagation under impact and static loads, with different slip systems activated based on crystal orientation. Impact loads cause rapid cracking and fatigue, while static loads show near-linear force increases with some non-linearity during unloading. Hertzian cone cracks are confirmed for R-plane under impact but uncertain for other planes. The research provides insights for improving sapphire applications in machining and device performance.
研究不足
The study is limited to specific crystal orientations and loading conditions; it does not cover all possible orientations or extreme environments. The equipment may have measurement inaccuracies, and the cone crack occurrence for A-, C-, and M-planes is uncertain. Future work could optimize test parameters and explore more orientations.
1:Experimental Design and Method Selection:
High-frequency cyclic impact tests and static load indentation tests were performed using a self-developed high-frequency cyclic impact fatigue tester. The tests aimed to analyze force signals and fracture morphology under different loading conditions.
2:Sample Selection and Data Sources:
Four sapphire specimens (A-plane, C-plane, M-plane, R-plane) with dimensions 10 mm × 10 mm × 0.43 mm were used, provided by Helios New Materials Limited. Specimens were polished to average surface roughness Ra < 0.30 nm to eliminate defects and residual stress.
3:43 mm were used, provided by Helios New Materials Limited. Specimens were polished to average surface roughness Ra < 30 nm to eliminate defects and residual stress. List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Equipment includes a high-frequency cyclic impact test device with a Rockwell indenter (diameter 0.1 mm), piezoelectric force sensor (Kistler type 9203), charge amplifier (Kistler Type 5018A), data acquisition card (DEWESoft SIRIUS MINI solution), laser displacement sensor (LK-G5000 series, Keyence), scanning electron microscopy (SEM-Phenom ProX desktop and ZEISS EVO18), and white-light interferometer (Zygo NV7300). Materials include sapphire specimens and diamond indenter.
4:1 mm), piezoelectric force sensor (Kistler type 9203), charge amplifier (Kistler Type 5018A), data acquisition card (DEWESoft SIRIUS MINI solution), laser displacement sensor (LK-G5000 series, Keyence), scanning electron microscopy (SEM-Phenom ProX desktop and ZEISS EVO18), and white-light interferometer (Zygo NV7300). Materials include sapphire specimens and diamond indenter. Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: For impact tests, specimens were fixed on an ultrasonic actuator, oscillated at 20 kHz with amplitudes of 4, 6, 8, 10 μm and impact times of 1, 2, 3, 4 s. Force signals were recorded. For static load tests, sequential loading-unloading was performed with feed intervals of 1 μm, maximum depths of 4, 6, 8, 10, 12, 14 μm, and holding time of 10 s. Surface morphology was analyzed using SEM and white-light interferometer.
5:Data Analysis Methods:
Force signals were analyzed for peak forces and fatigue stages. Fracture morphology was examined to identify crack systems and propose models based on crystal orientation. Three-dimensional morphology was measured for deformation analysis.
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scanning electron microscopy
EVO18
ZEISS
Observing surface morphology
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white-light interferometer
NV7300
Zygo
Measuring three-dimensional morphology
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force sensor
9203
Kistler
Measuring impact forces during tests
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charge amplifier
5018A
Kistler
Amplifying piezoelectric signals from force sensor
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data acquisition card
SIRIUS MINI
DEWESoft
Recording force signals
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laser displacement sensor
LK-G5000 series
Keyence
Measuring oscillation amplitudes
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scanning electron microscopy
Phenom ProX
Phenom
Observing surface morphology
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Rockwell indenter
Performing indentation tests
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linear encoder system
RG2
Renishaw
Ensuring positioning accuracy
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