研究目的
To develop a material with high stretchability, superior electrical/thermal conductivity, and improved shape memory properties for applications in soft electronics and wearable technology, by fabricating a reentrant micro-honeycomb structure of graphene-CNT in polyurethane.
研究成果
The reentrant micro-honeycomb graphene-CNT/SMPU composites exhibit high electrical and thermal conductivities, low resistance changes under strain, and superior shape memory properties, making them suitable for applications like emergency circuit breakers in portable electronics. The structured approach enhances crystallization and conductivity synergistically.
研究不足
The study focuses on tensile deformation and may not address other types of mechanical stresses. The composite fabrication involves multiple steps that could be optimized for scalability. The electrical and thermal properties are evaluated under specific conditions and may vary in different environments.
1:Experimental Design and Method Selection:
The study used an ice-templated self-assembly method to create a directionally porous micro-honeycomb graphene-CNT structure, followed by radial compression to form a reentrant structure. SMPU was infiltrated into this structure to form composites.
2:Sample Selection and Data Sources:
Graphene oxide (GO) powder and single-wall CNT were purchased, and SMPU was synthesized. Samples included neat SMPU and various composites.
3:List of Experimental Equipment and Materials:
Materials included GO powder (GO-A400), CNT (eDIPS EC
4:0), poly(ε-caprolactone) diol, MDI, BD, DMAc, DMSO, HI vapor, etc. Equipment included sonicator (VCX-750), freeze dryer, FE-SEM (JEOL JSM-6701F), DSC (Perkin Elmer DSC 4000), thermal conductivity analyzer (TCi), IR camera (E40, FLIR system), DMA (TA Instruments Q800), multimeter (6512, Keithley), and home-made strain equipment (T-LSM100B, Zaber Technologies). Experimental Procedures and Operational Workflow:
GO and CNT were dispersed and mixed, frozen directionally or randomly, freeze-dried, reduced with HI vapor, radially compressed, and SMPU was infiltrated. Characterization involved SEM, DSC, thermal conductivity measurements, DMA for shape memory properties, and strain-resistivity tests.
5:Data Analysis Methods:
Data were analyzed using equations for crystallinity, shape fixity, recovery ratio, and software like LabVIEW for resistivity measurements.
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FE-SEM
JSM-6701F
JEOL
Used for observing surface and cross-section morphology.
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DSC
DSC 4000
Perkin Elmer
Used for investigating thermal properties.
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IR Camera
E40
FLIR system
Used for recording surface images over time.
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Multimeter
6512
Keithley
Used for measuring resistance in strain-resistivity tests.
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Strain Equipment
T-LSM100B
Zaber Technologies
Home-made equipment for implementing strain-resistivity tests.
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Graphene Oxide Powder
GO-A400
Grapheneall
Used as a raw material for fabricating the graphene-CNT structure.
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Single-wall CNT
eDIPS EC2.0
Meijo Nano Carbon
Used as a raw material for fabricating the graphene-CNT structure.
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Sonicator
VCX-750
Used for dispersing GO and CNT in water.
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Thermal Conductivity Analyzer
TCi
Used for assessing thermal conductivity.
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DMA
Q800
TA Instruments
Used for dynamic mechanical analysis to confirm shape memory properties.
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