研究目的
To investigate the effect of cut depth and distribution of abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon, aiming to optimize the process for better surface topography suitable for acidic texturization.
研究成果
The study concludes that brittle fracture is the primary material removal mode in diamond wire sawing, with ductile removal contributing less than 10% of the total volume. Increasing feed rate or decreasing wire speed reduces the number of active abrasives, favoring brittle fracture surfaces. A critical position angle θc exists for abrasives to affect surface morphology, varying with wire parameters but not process parameters. Optimizing feed rate and wire speed ratio can enhance cutting efficiency and surface quality for acidic texturization.
研究不足
The model assumes no elastic deformation of the wire saw or workpiece, and does not account for vibrations or environmental conditions. It uses a simplified abrasive shape (hemispherical top with conical base) and fixed critical cutting depth (dc=0.5 μm), which may not capture all real-world variabilities. The simulation is based on ideal conditions without experimental validation from physical tests.
1：Experimental Design and Method Selection:
A mathematical model based on indentation fracture mechanics was developed to simulate the diamond wire sawing process, considering process parameters (feed rate, wire speed) and wire saw parameters (core diameter, abrasive size, density). The model includes variations in cutting groove profiles for different material removal modes (ductile and brittle).
2：Sample Selection and Data Sources:
The study uses polycrystalline silicon as the workpiece material, with mechanical properties specified (Young's modulus E=170 GPa, Mohs hardness H=7 GPa, fracture toughness Kc=0.75 MPa·m^1/2). No specific sample selection criteria are detailed beyond material properties.
3：75 MPa·m^1/2). No specific sample selection criteria are detailed beyond material properties.
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Electroplated diamond wire saw is used, with parameters such as core wire diameter (80 μm), mean abrasive diameter (8 μm), abrasive size range (6-10 μm), and abrasive density (300 abrasive/mm^2). MATLAB software is employed for numerical simulations.
4：2). MATLAB software is employed for numerical simulations.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The simulation involves discretizing the wire saw cross-section, generating abrasive sizes with normal distribution, calculating cutting depths based on position angles, and updating the cutting groove profile iteratively for each abrasive pass. The process includes determining material removal mode (ductile or brittle) and its effect on surface morphology.
5：Data Analysis Methods:
Results are analyzed to determine the distribution of abrasives in ductile and brittle modes, average cutting depths, and the critical position angle θc. The area of material removed is compared to theoretical values to validate the model.
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