1：Experimental Design and Method Selection:

The study involved exposing fluoropolymer films to different environmental conditions to assess degradation. Methods included abrasive wear tests using AFM, exposure to elevated temperatures, UV radiation, and plasma treatments.

2：Sample Selection and Data Sources:

Films were deposited on single crystal N-type Si (100) wafers using PECVD with c-C4F8 gas. Samples were handled with tweezers to avoid contamination.

3：List of Experimental Equipment and Materials:

Equipment included an STS Multiplex ICP DRIE etcher for deposition, UVISEL ellipsometer for thickness measurement, NanoWizard II AFM for topography and wear tests, Escalab 250 XPS system for composition analysis, High Temperature Heated Stage for temperature exposure, UVLS-28 EL Series UV Handheld Lamp for UV exposure, and custom environmental chamber. Materials included c-C4F8 gas, Si wafers, and various gases for plasma treatments.

4：Experimental Procedures and Operational Workflow:

Films were deposited with specific parameters, then subjected to wear tests at different temperatures and loads, temperature cycles, UV exposure at different wavelengths and atmospheres, and plasma exposure. Thickness and topography were measured before and after treatments.

5：Data Analysis Methods:

Thickness was measured using ellipsometry with a four-phase model, topography was analyzed with AFM software, composition was determined by XPS, and wear coefficients were calculated using the Archard equation.