研究目的
To address the increasing importance of power dissipation and thermal management in semiconductor devices by designing and implementing a versatile thermal test vehicle for simulating thermal loads, evaluating cooling solutions, and supporting thermal-aware design throughout the chip development cycle.
研究成果
The next-generation thermal test vehicle is highly flexible and programmable, enabling applications in chip floor-planning, package development, and customer use case evaluations. It provides accurate thermal data for mitigating thermal risks in power-intensive chips, with demonstrated results in various scenarios including IoT FPGA applications.
研究不足
The accuracy of temperature readout is +/-2°C across 30°C to 125°C, with potential for +/-1°C in controlled samples. The system requires proper thermal dissipation and cooling to prevent overheating. It is limited to the specific chip architecture and may not cover all possible thermal scenarios.
1：Experimental Design and Method Selection:
The study involves designing a semiconductor chip with on-chip heating elements and temperature sensors, using a 4-bank architecture with sectors containing resistors, diodes, and ring-oscillators for heat generation and sensing. Digitization of analog signals is employed for simplified data acquisition.
2：Sample Selection and Data Sources:
The chip is fabricated using 0.18um technology and assembled in a flip-chip package. Silicon data is collected from the chip under various programmed heat profiles.
3：18um technology and assembled in a flip-chip package. Silicon data is collected from the chip under various programmed heat profiles.
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: The chip itself, a simple and inexpensive tester for programming and measurement, external heating sources for calibration, and various package types and cooling solutions for evaluation.
4：Experimental Procedures and Operational Workflow:
The process includes calibration by heating the packaged unit to thermal equilibrium and creating a look-up table, heat programming by setting power levels in sectors, and sensing temperature using digitized outputs. Software controls the programming and data readout.
5：Data Analysis Methods:
Temperature data is analyzed to plot spatial and temporal profiles, compare with simulation results, and evaluate thermal behavior under different conditions.
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