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Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation

DOI:10.1142/S1758825118501107 期刊:International Journal of Applied Mechanics 出版年份:2018 更新时间:2025-09-23 15:23:52
摘要: Finite element (FE) simulation is adopted as a fundamental tool to evaluate the mechanical reliability of packaging structures for electronic devices. Nevertheless, the determination of mechanical properties of sintered silver nanoparticles (AgNP) remains challenging as the traditional tensile test is difficult to be performed at a limited size. In the current study, spherical nanoindentation is utilized to measure the applied load-penetration depth responses of sintered AgNP reinforced by SiC microparticles at various weight ratios (0.0, 0.5, 1.0 and 1.5 wt.%). To describe the elasto-plastic behavior of this heterogeneous material, FE analysis is performed to simulate the indentation behavior and determine the parameters in the modified power-law model by fitting the average applied load-penetration depth responses. To overcome the uniqueness problem, the Young’s modulus is directly determined by continuous stiffness measurement technique and the proposed constitutive model can provide a reasonably accurate mechanical estimation of sintered AgNP. The effect of SiC content on sintered AgNP is discussed by correlating the morphology observed by scanning electron microscope (SEM) and the constitutive parameters obtained from the FE simulations.
作者: Xu Long,Chongyang Du,Zhen Li,Hongcun Guo,Yao Yao,Xiuzhen Lu,Xiaowu Hu,Lilei Ye,Johan Liu
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To investigate the constitutive behavior of sintered silver nanoparticles reinforced with SiC microparticles using finite element analysis to simulate nanoindentation responses and determine mechanical properties for improving the reliability of electronic packaging structures.

FE analysis effectively simulates nanoindentation of sintered AgNP with SiC reinforcement, allowing determination of constitutive parameters. The optimal SiC content is 0.5 wt.%, yielding lower porosity (14.42%), higher yield strength, and improved mechanical properties. SiC addition increases work-hardening rate but reduces strain hardening exponent. The Young's modulus and hardening capacity influence pile-up deformation. Mechanical properties can be tuned by SiC content for enhanced reliability in electronic devices.

The study simplifies the porous microstructure of sintered AgNP to an equivalent solid in FE models, which may not fully capture porosity effects. Surface roughness from porosity affects initial indentation stages, requiring a penetration depth threshold for reliable analysis. The friction coefficient between indenter and material is assumed, and exact values are unavailable. The method relies on fitting and may have uniqueness issues in parameter determination.

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