研究目的
To investigate the structural, electrical, and optical properties of vanadium oxide thin films fabricated by unbalanced magnetron sputtering for smart window applications, focusing on the effects of various annealing temperatures.
研究成果
VOx thin films fabricated by UBMS showed improved crystallinity and electrical properties with increasing annealing temperature, but decreased optical transmittance due to increased surface roughness. These findings are significant for optimizing smart window materials, suggesting that higher annealing temperatures enhance electrical performance at the cost of optical clarity, and future work could explore balancing these properties for practical applications.
研究不足
The films were very thin and amorphous, leading to weak XRD peaks and potential limitations in crystallinity analysis. The study is limited to specific annealing temperatures and may not cover all possible conditions for optimization in smart window applications.
1:Experimental Design and Method Selection:
Vanadium oxide thin films were deposited using an unbalanced magnetron sputtering system with a vanadium metal target and O2 reaction gas, followed by thermal annealing at various temperatures to study their properties.
2:Sample Selection and Data Sources:
Eagle glass substrates (25 × 25 × 1 mm) were used, cleaned ultrasonically in methanol, acetone, and deionized water, and dried with nitrogen gas.
3:List of Experimental Equipment and Materials:
Unbalanced magnetron sputtering system, vanadium metal target (3 inches, purity 99.9%, LTS Inc.), Eagle glass substrates, Ar and O2 gases, furnace for annealing in N2 ambient, FESEM (XL-40aFEG, 10 kV) for thickness measurement, AFM (NITECH, SPM 400, contact mode with Si-DF40 tip) for surface morphology, XRD (D8 Advance, Bruker Corp., Cu Kα radiation, λ=1.5418 ?) for crystalline structure, UV-VIS-NIR spectrophotometer (UV-3600, Shimadzu) with homemade sample heating stage for transmittance and thermochromic measurements.
4:9%, LTS Inc.), Eagle glass substrates, Ar and O2 gases, furnace for annealing in N2 ambient, FESEM (XL-40aFEG, 10 kV) for thickness measurement, AFM (NITECH, SPM 400, contact mode with Si-DF40 tip) for surface morphology, XRD (D8 Advance, Bruker Corp., Cu Kα radiation, λ=5418 ?) for crystalline structure, UV-VIS-NIR spectrophotometer (UV-3600, Shimadzu) with homemade sample heating stage for transmittance and thermochromic measurements.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Substrates were cleaned and placed 60 mm from the target. Base pressure was 1.1 mPa, working pressure 0.4 Pa with Ar/O2 gas mixture (100/20 sccm), target power density 5 W/cm2 at room temperature. Films were deposited to ~120 nm thickness, then annealed in N2 ambient for 2 hours at temperatures from 300°C to 500°C. Properties were measured post-annealing.
5:1 mPa, working pressure 4 Pa with Ar/O2 gas mixture (100/20 sccm), target power density 5 W/cm2 at room temperature. Films were deposited to ~120 nm thickness, then annealed in N2 ambient for 2 hours at temperatures from 300°C to 500°C. Properties were measured post-annealing.
Data Analysis Methods:
5. Data Analysis Methods: Structural analysis via XRD patterns, surface morphology via AFM and FESEM images, optical properties via transmittance spectra, electrical properties via sheet resistance, resistivity, carrier concentration, and mobility measurements.
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